Napa, Calif.-Hosted annually by the Die Products Consortium, the KGD Workshop focuses on semiconductor die products test, assembly, manufacturing, and business issues at the forefront of the microelectronics industry. The 2008 KGD Packaging & Test Workshop will be held September 7-10, 2008 at the Embassy Suites in Napa Valley. [more]

San Jose, Calif. & Zurich, Switzerland -IBM announced two major scientific achievements in the field of nanotechnology that could one day lead to new kinds of devices and structures built from a few atoms or molecules. [more]

San Francisco, Calif.-It was an informative week at Intel Developer Forum (IDF), which ran August 19 - 21, 2008. Upon reflection, the following remarks should provide those involved in chip assembly and packaging pause. If we thought that back-end processing was tough now, just wait! [more]

San Jose, Calif.-IC unit shipments are expected to grow from 151 billion units in 2007 to 262 billion units in 2012-a compound annual growth rate (CAGR) of 11.6 percent. Market research firm Electronic Trend Publications (ETP) believes that IC revenue growth should nearly equal unit growth over the forecast period-provided that the industry is cautious in the addition of capacity. [more]

Wellesley, Mass-According to a new technical market research report, "The Global Market For Thin Films In Energy Applications" from BCC Research, the global market for thin films in energy applications was worth $1.1 billion in 2007. This is expected to increase to $1.4 billion in 2008 and $3.9 billion in 2013, for a compound annual growth rate (CAGR) of 23.5%. [more]

El Segundo, Calif.-U.S. automakers are falling behind their foreign counterparts in the fast-growing area of providing ecologically oriented features in car navigation and telematics systems, according to iSuppli Corp. [more]

Yorktown Heights, N.Y.-IBM and its joint development partners -AMD, Freescale, STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE)-announced the first working static random access memory (SRAM) for the 22 nanometer (nm) technology node, the world's first reported working cell built at its 300 mm research facility in Albany, NY. [more]

San Diego, Calif.-SEMATECH [sematech.org] will host global experts representing a broad spectrum of the semiconductor industry at a workshop designed to explore manufacturing and reliability challenges for three-dimensional integrated circuit (3D IC) products. The forum, entitled "Manufacturing and Reliability Challenges for 3D ICs using TSVs," will be held at the Del Mar Fairgrounds in San Diego, California. [more]

Bannockburn, Ill.-HDI (high density interconnect) technology represents the fastest growing segment of the global PWB market; yet the use of high density interconnects in North America has lagged behind the rest of the world. To help North American PWB companies increase their competitive advantage, IPC - Association Connecting Electronics Industries will offer a three-day "HDI Technology Conference: Building the Supply Chain Infrastructure," October 6-8, 2008 in Dallas. [more]

San Jose, Calif.-This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair. [more]

Rogers, Conn.-Rogers Corp. licensed a highly compliant thermal interface material technology from International Business Machines (IBM). This technology is used in high performance and high reliability chip packaging applications where heat management becomes a limiting factor. Rogers plans to integrate this product line into its Thermal Management Solutions family of products. [more]

Norton, Mass.-The CPS Technologies Corp. AlSiC large format AlSiC flip-chip lids are used for System in Package IC improve device reliability and enable new packaging approaches. CPS produces metal matrix composite products provide thermal management and structural reliability. The AlSiC (Aluminum Silicon Carbide) metal matrix composite lids are used in large format for SiPs in high-performance workstations, servers, video processing, data communication products, internet routers and at high frequency and RF packaging applications where performance and reliability are critical. [more]

Singapore-Ellipsiz Ltd. announced that its wholly owned subsidiary, SV Probe, has expanded into South Korea and has appointed Mr. Jong Ho Yoon as President. This move is described as yet another part of SV's growth strategy to increase its share in the memory and Asian probe card markets. This expansion will also aid SV with its entrance into the CMOS Image Sensor probe card marketplace. [more]