Exploring applications, materials and process requirements necessary for pervasive products:
April 26, 2018 – NextFlex Facility - San Jose, CA - Unlike computers and mobile phones, the Internet of Things demands a wide range of different functions in different products, and most of them need flexibility, thinness, and ultralow power consumption. These requirements can only be satisfied with new methods of packaging.
This event will explore the market opportunities, emerging applications, and materials and process requirements to provide this functionality at an affordable cost. You’ll hear from experts in polymers and other flexible materials, effects of complex packaging structures on signal integrity, speed and power consumption, and the latest and most promising technology for heterogeneous packaging. Topics will also include cutting edge/niche concepts in medical implantable devices and "synthetic skin", etc.
The challenges include:
May 16-17, 2018 - Dallas, TX - INEMI, MEPTEC and SMTA have joined forces to again host this international conference, focusing on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. Prior this conference were held in Phoenix, Arizona and Milpitas, CA, and Portland, OR respectively, drawing technology experts, entrepreneurs and service providers that work in this niche technology space.
Typical applications within this space involve implantable defibrillators, neurostimulators and drug delivery, interventional catheters, pillcams, ultrasound transducers, hearing aids, biosensors, microfluidics, wireless communications, as well as future diagnostic and treatment solutions that may use stretchable electronics, microelectromechanical systems (MEMS) or nanoelectromechanical systems (NEMS).
For additional information: www.smta.org/medical