San Jose, CA USA - July 25, 2018 - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters and program for the 15th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 23-25, 2018 at the DoubleTree by Hilton Hotel in San Jose, California. A compelling technical program awaits in this year’s conference. The technical program has three parallel tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing technologies. Building on last year’s success IWLPC will again feature an international stage panel discussion entitled: “Scaling-Up Panel-Level Processing: Challenges and Opportunities”. IWLPC will deliver four Professional Development Courses and an Interactive Poster Presentation Session. Three keynote talks by distinguished leaders in the industry will take center stage.
Grenoble, France - September 19-21, 2018 - MEMS and sensors devices are applied in a diverse and growing list of products – mobile, automotive, industrial, health/medical, etc. With the top MEMS and sensors producers, RTO’s, Start-ups located in Europe, Grenoble is a fitting location to connect international experts and industry executives with each other. The event will offer numerous opportunities for attendees to network and develop their business interests. Due to the co-location with Imaging & Sensors Summit – it is the only event where industry executives can exchange directly ideas and information coming from both technology communities. Join us at MEMS & Imaging Summits!
For additional information: http://www.semi.org/eu/mems-and-sensors-2018-home-page
Grenoble, France - September 19-21, 2018 -Imaging and Sensors applications are growing rapidly and the use of their devices is increasing: automotive, industrial, medical and agricultural applications drive to dramatic progress. What gained explosive growth as a smartphone feature has now evolved into an enormous spectrum of applications. The event will bring together stakeholders and c-level speakers to discuss new technologies, smart integration of different sensors for innovative applications and future market opportunities. Due to the co-location with MEMS & Sensors Summit – it is the only event where industry executives can exchange directly ideas and information coming from both technology communities. Join us!
For additional information: http:// www.semi.org/eu/imaging-and-sensors-summit-2018-home