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January • February 2018; Volume 22, Number 1

Cover Photo

A 300mm wafer and a 510 x 515mm panel are about to be electroplated for packaging. Electroplating at the panel scale is no longer a barrier for form factor adoption in packaging. Tokyo Electron has partnered with customers to develop cutting-edge processing equipment, such as the StratusTM P300 and P500 that can process the substrates shown to create fine packaging features at superior uniformities.

Cover photo courtesy of Tokyo Electron.


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With extensive product and process development expertise, customers can utilize Bourns for: We help fabless IC companies miniaturize and productize their chip-level designs into MMICs, CMOS, SiGe, GaAs, InP, GaN or SiC Multiple-Chip Modules, 100-400Gbps Optoelectronic Packages or RF/Microwave Board Assemblies.

Industry News

IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017

San Jose, California – USA – The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation. ...>>

Emmanuel Sabonnadiere named LETI CEO

GRENOBLE, France – Nov. 28, 2017 – Leti, a technology research institute of CEA Tech, today announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.
Sabonnadiere, who has more than 25 years of executive leadership experience in a variety of large technology environments, joins Leti from CEA Tech, where he led the industrial-partnership program. He brings a strong background in new-technology development with broad private-sector expertise in operational excellence, team building and guiding multicultural organizations in business transformation in Europe and globally. ...>>

Heterogeneous integration paving the way beyond silicon scaling limits

As in prior years, the in-depth presentations at this year's IWLPC, covering a broad array of the industry's critical challenges, did not disappoint. A series of keynote presentations and papers included a couple of major announcements that will be discussed below. Of special note, several keynote speakers focused on heterogeneous integration and the added complexities of migration to large rectangular panels. The session presentations reported impressive progress in material science, manufacturing processes, new equipment, metrology, and testing. A few selected highlights, only limited by the allotted space, are included below. ...>>

Industry Events

Advanced Packaging for Flexible Electronics

April 26, 2018 – NextFlex Facility - San Jose, CA - Unlike computers and mobile phones, the Internet of Things demands a wide range of different functions in different products, and most of them need flexibility, thinness, and ultralow power consumption. These requirements can only be satisfied with new methods of packaging. ...>>

2018 Medical Electronics Symposium

May 16-17, 2018 - Dallas, TX - INEMI, MEPTEC and SMTA have joined forces to again host this international conference, focusing on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. Prior this conference were held in Phoenix, Arizona and Milpitas, CA, and Portland, OR respectively, drawing technology experts, entrepreneurs and service providers that work in this niche technology space. ...>>