2018 Issues

January • February 2018; Volume 22, Number 1

A 300mm wafer and a 510 x 515mm panel are about to be electroplated for packaging. Electroplating at the panel scale is no longer a barrier for form factor adoption in packaging. Tokyo Electron has partnered with customers to develop cutting-edge processing equipment, such as the StratusTM P300 and P500 that can process the substrates shown to create fine packaging features at superior uniformities.

Cover photo courtesy of Tokyo Electron.

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