A residue-free locating agent is used to hold the solder balls on wafers. A production-scale reflow furnace containing a hydrogen activation function is used to reflow wafers in a non-flammable gas mixture of hydrogen in nitrogen. 100% ball attachment with good solder wetting and strong solder bonding is achieved. This technology eliminates residues and cleaning, thereby facilitating the industrial trend toward device miniaturization.
Photo courtesy of Air Products and Chemicals, Inc.
An illustration of the latest development towards the integration of ultra-thin silicon bare dies within a flexible film. ChipInFlex is a generic wafer-level process for manufacturing a flexible label that integrates silicon components. Working on a silicon carrier helps achieve a high resolution of integration. The process described is the first to offer flipchip silicon dies interconnection within a flexible film and collective thinning.
Data centers (i.e., AI, machine learning, deep learning, computation run-off data center hardware) are driving next generation semiconductor packaging, especially 2.5D and 3D integrations. In particular, data centers are the primary target market for 3D DRAM, 3D NAND for SSDs, and 2.5D CPU/GPU/FPGA/SoCs, etc. These devices are the focus of all the large semiconductor companies for not only their current high-end product lines, but also those of the future.
Automotive applications are driving a number of packaging technologies, such as reliability of packaging materials and screening of SoCs. But flexible hybrid electronics (e.g., for biosensors and personal wearable body monitors) and “More than Moore” nontraditional scaling are also pushing the packaging market segment forward. This issue covers the above topics in detail across a broad swath of the packaging industry.
Whether it’s 5G applications, bioimplantable electronics, the growing demand for power devices, or other challenges, the semiconductor packaging industry, powered by human brainpower, has always risen to the occasion. Looking ahead, we may be looking at artificial intelligence to help power the future of packaging design, manufacturing, and test. Enjoy the issue!
The emergence of next-generation 5G, WiFi protocols, and automotive radar have pushed ICs into extreme frequency bands. High-volume 6GHz production test cells are being modified to up-convert, mix, down-convert, source, and measure for both cmWave (3GHz to 30GHz) and mmWave (30GHz to >100GHz) frequencies. Test interface hardware has now become a key differentiator for bringing these next-generation applications to market, with relatively few solutions available.
Cover image courtesy of Cohu