By way of background, STECO was established in
June 1995, with Samsung as 51 percent owner and Toray a 49 percent
owner. Until recently, however, STECO was captive to Samsung for packaging
flip-chip-on-film, tape carrier packages and TAB. In July 1998, STECO
began running the µBGA package in volume production.
The STECO factory now offers a capacity of five million TCPs per
month and two million µBGA packages per month, according to Oh.
While the company still reports to Samsung, its services are now
available on the open market, Oh emphasized.
The factory at Chichiwon, Korea, employs a workforce of some 236,
and has a production area of 4,596 meters square in a 9,830 meter
square building. Half of the production area is currently reserved
for future expansion. For more information, contact STECO's U.S.
rep, Steven Han at shan@logusinc.com
or peruse the STECO Web
site.
Add ATEC
Speaking of packaging foundries, you can add a new one, ATEC International,
in the Light Industry and Science Park at Cabuyao, Laguna, Philippines,
to your A list.
We learned about ATEC from Sam Gomez, formerly of Pacific Semicon-ductor,
at November's MEPTECH conference in San Jose.
ATEC was founded about six years ago as ATI. Until its rebirth
as ATEC, the company populated PC boards and assembled desktop computers.
"ATEC is completely new, with 100,000 square feet currently and
plans to expand into another 100,000 square feet," Gomez, vice president
of sales and marketing, says.
The assembler is specializing in MCMs, hybrids, multichip packages,
chip-on-board and special orders. Contact Gomez at the company's
U.S. sales office: ATEC International Corp., 2033 Gateway Place,
Suite 600, San Jose, CA 95110. E-mail sgomez@atec-us.com or phone 408.573.6805.
We've Got
Answers
Here are the answers to our trivia quiz from the November-December
issue. If you missed the questions, visit our hosted Web site at
ChipScaleReview.com.
The winner was Dennis Wagner of Precision Technologies Inc., Santa
Clara.
1. Indy Electronics originally operated plants in Manteca, Calif.
and Mexico.
2. Before Amkor became the dominant IC assembler, Stanford Microsys-tems
Inc., Manila, was the IC packaging leader. Pictured was Chris Concepcion,
its chairman.
3. W. D. Smith was the founder of MEPPE, predecessor of MEPTEC.
The original board members were Norbert Emanuel, Paul Flaskerud
and Duane Wadsworth.
4. Bob Marrs, founder of Abpac Inc., left the industry for several
years to import shrimp from Mexico.
5. Nandi Prasad, now president of Gateway Electronics, a Philippines-based
IC assembler, was the first GM of this former American Microsys-tems
Inc. plant.
6. Deltron Automation was funded originally by Deltron Motors.
Prncipals included Dr. Robert Tyler, Robert Prescott and Ray Brachelli.
7. Abpac, Advanced Microtronics Technology, Alphatec, Amertron,
Amkor, Apack Technologies, ASAT, ASE and now ATEC. Have we left
out anybody?
8. Karl Nicklaus, ESEC chairman
9. Paul Driscoll, formerly with National Semiconductor
10. Casablanca in Algiers, North Africa
11. Fairchild Semiconductor set up an IC assembly plant at Shiprock,
N.M., on an Indian reservation.
12. Amkor is headquartered in West Chester, Pa. Its Chairman is
James Kim.
Give yourself a pat on the back if you got them all right. Until
next issue, send your news to me at chipreview@
mediaone.net.