S-TBGA Package Assembly

Signetics, the experience leader in IC assembly, offers one of the industry's widest ranges of package types, including the S-TBGA format. The S-TBGA is available in body sizes of 27 mm x 27 mm, 31 mm x 31 mm and 40 mm x 40 mm with a variety of ball counts. Since 1965, Signetics has delivered quality, global customer support and advanced packaging and test technology.

For more information, e-mail: department200@signeticsusa.com or visit our Web site at www.signetics.com

Allteq Industries L1520e Dispensing Station

The Allteq L1520e dispensing station is a fully-automatic system designed to dispense a variety of different materials. Applications for the L1520 include die coating, encapsulation, moisture protection and under-filling, Standard features include programmable XYZ dispensing, 0.600 inch-3.150 inch leadframe width capability, built-in diagnostics and fast product changeover. Allteq provides complete product support through offices and reps in the U.S., Europe and Asia.

For more information, e-mail:dispensing@allteq.com or visit us on the Web at www.allteq.com.

Automatic Gull Wing Conditioning System

Precision Technologies Inc. has introduced the Series 500 fully automatic "kit-less" gull wing lead conditioning system with optional 3-D BGA scanning. The compact system inspects and repairs packages for co-planarity, negative foot angle, bent leads, sweep, standoff, leg angle and terminal dimension. Machine features include a servo-adjustable lead repair module, single JEDEC tray onload/offload, programmable device and tray thickness adjustment and linear servo-motor pick-and-place. Device size capability is from 5 mm to 32 mm.

Seiko Epson NS6000 Series IC Test Handler

Kanematsu USA is offering the Seiko Epson NS6000 Series single-, dual- and quad- site IC test handler, successor to the NS5000 Series. The unit offers an index time of less than 0.35 seconds, maximum throughput of 4300 UPH, active cooling system and built-in 3D BGA/gull wing lead/ball scanning. In addition, network monitoring capability and automatic temperature calibration are standard features.

Contact Bill Mowry, Kanematsu USA Inc., 408.522.9771, e-mail:b.mowrykg@worldnet.att.net

Fully Automatic BGA Ball Attach System

Kanematsu USA is offering the MISUZU FA system, featuring high yield and flexibility for attaching small balls at very fine pitches to a wide variety of substrates or to 4-8 inch wafers. The BA-1110 (shown) is designed for PBGA, TBGA and µBGA (CSP) packages. The BA-1100W has been developed for wafer-level CSP and employs a screen-printing method to transfer flux or solder paste.

High-Performance CSP Test Sockets

Tecknit Interconnection Products is offering a new test socket design for 0.5 mm pitch packages, utilizing Fuzz Button technology. Test socket characteristics include less than 1 nh inductance, low parasitics, high actuation levels and superior contact compliance and repeatability. The new socket design optimizes cost of ownership by enabling the same socket to be used in both hand test and automated test applications.

Contact Bill Richline at brichline@tecknit.com or phone 908.500.0092, fax 800.443.1085. [www.tecknit.com]