The Traditional Boundries Have All but Disappeared The traditional boundaries between component (first-level packaging) and card assembly (second level-packaging) have all but disappeared. Not only are the ubiquitous "smaller, cheaper, faster" drivers forever reshaping electronics, but the demand for multi-functionality and mobility are fueling the convergence of the computer, telecommunications and consumer markets. As an advanced packaging equipment supplier, we will be asked to meet an ever-widening range of technical and business challenges. New materials for semiconductors, substrates, interconnect metallurgies and ßux/underÞll combinations are enabling new applications and creating new requirements for die placement.
Turning our attention to the substrate side of the package, we foresee major changes occurring there as well, enabling advanced packaging, high density rigid and flex substrates. Manipulating and imaging of these novel carriers are driving changes in equipment handling and vision systems. Placement accuracy is of paramount importance, but not at the expense of productivity. What about the manufacturing processes used in these high-end assemblies? New ßuxes, new underfills, combinations of ßux and underÞlls, and new conductive adhesives are enabling high-end assembly techniques such as ßip-chip and wafer-level processing. This translates into dispensing, vision and placement challenges on the equipment side. Also, the regulatory push in Asia and Europe to eliminate lead will force the use of more lead-free solders, because these solders require much higher reflow temperatures will be put more pressure on the substrate materials. The drive to eliminate lead will also push the increased use of conductive adhesives that require higher pressure and temperature during placement, greatly impacting machine throughput. All of these new applications require different permutations of possible materials and processes, which lead to a multiplicity of packages and form factors. This will require placement equipment to be even more flexible. In addition, more sophisticated vision systems and lighting schemes are needed to handle a myriad of different substrates and new process materials. On top of this, there is always the need to increase throughput while improving accuracy. And finally, advanced packaging houses will partner with suppliers that offer both equipment and process solutions for state-of-the-art assemblies, global supply capabilities and best-of-breed cost of ownership.-Gerhard D. Meese, President, Universal Instruments Corporation
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