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 Publisher's Letter
A Look Forward to the Year Ahead

 Assembly Lines
Pantronix Continues Expansion with Facility Planned for Shanghai, China

 Wafer Level Watch
The Allure of Parallel Processing: Defects Are Found Earlier, More Easily

 Harvey Miller's Notebook
Innovex and Substrate Technologies' Goal: Make Form Fit Function

 On Test

Credentials for Testing Are Escalating; Enter the Certified Smart Person (CSP)

 Flip-Chip Focus
Issues in Reworkable Underfills for Low-Cost Flip-Chip Applications

 Industry News
Company News
Research Reports
Packaging Foundries
People in the News
FSA 6th Annual Suppliers Day
Calendar of Events
Editorial Index

 Features
Forecast 2001
The Experts Look at the Issues

Demands for Higher Speed and Greater Accuracy Are Driving the Die Placement Equipment Market

Die Attach Equipment: What Packaging Foundries Want

CSPs Present New Challenges for Die Attach Equipment

How Bluetooth Packaging Choices Impact System Cost

Achieving High Accuracy and High-Throughput Assembly with Flip-Chip-on-Flex

Web-Based Collaborative IC Package Design

 Tutorial
An Overview of Flexible Printed Circuit Technology

 Technical Forum
How New Developments in Hydrofluorocarbon Cleaning Technology Impact Flip-Chip Package Production
Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder

 Tools & Technologies
Tray Changer Hikes Placement Productivity and more...

 Opinion
Something's Rotten in Stockholm: The Nobel Prize Committee and the IC

 Patents
Micro-Machined Wafer-Level Package Employs a Memory Wafer with a Silicon Nitride, SiO2 or SOG Passive Layer

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January - February 2001

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Die Attach Equipment: What Packaging Foundries Want

 Back
Die Attach Equipment Manufacturers
The selective listing below, while supplied by each manufacturer, is not all-inclusive as to company or to each listed company's product line, and Chip Scale Review assumes no liability for typographical errors or misprints. For the latest information please contact the company representative as printed in the table.

Company
Contact Phone, Fax
Founded
Model
Introduced
Largest Wafer Size
Bonding Cycle Time
Epoxy Write?
M, S-A or Auto
Strip Map Capable?
Die Sizes
Leadframe/Substrate
Size
(Inches)
Web Site
Contact Name
Contact E-mail
Alphasem AG
(A Universal Instruments Company)
Andhauserstrasse 64
CH-8572 Berg/TG Switzerland
Ph: +41.71.637.63.63
Fax: +41.71.637.63.64
Founded: 1979
Swissline 9022
May 2001
300 mm
4k units/hr.
Yes A
Option
0.5-21 mm
22 x 120 mm to 90 x 250 mm
(0.87 x 4.72 inches to 3.54 x 9.84 inches)
[alphasem.com]
Daniel Schudel
[info@alphasem.com]
Dimensions: 1700 x 1000 x 2000 mm (66.9 x 39.4 x 78.8 inches)
Swissline 9022 FC
July 1998
200 mm
3k units/hr.
Yes A
Option
0.5-21 mm
22 x 120 mm to 90 x 250 mm
(0.87 x 4.72 inches to 3.54 x 9.84 inches)
Dimensions: 1645 x 1025 x 2020 mm (64.8 x 40.4 x 79.5 inches)
EasyLine 8002
July 1998
200 mm
7k units/hr.
No A
No
0.5-12.5 mm
10 x 95 mm to 90 x 270 mm
(0.4 x 3.74 inches to 3.54 x 10.6 inches)
Dimensions: 900 x 1100 x 1700 mm (35.4 x 43.3 x 66.9 inches)
ASM Assembly Automation Ltd.
4/F., Watson Center, 16 Kung Yip St.
Kwai Chung, Hong Kong
Founded: 1975
AD889
1998
200 mm
500 ms
Yes
A
Yes
1.0-17.7 mm2
15.2 x 76 mm
Dimensions: 1340 x 1230 x 1850 mm (53 x 48 x 73 inches)
DIAS Automation (North America)
(Division of DIAS Automation (HK) Ltd.)
94 Tokwawan Rd., Hong Kong
Founded: 1985
A-8020
July 2000
200 mm (single)
150 mm (dual)
1.5 s
Yes
A
Yes
0.25-20 mm
15 x 100 mm to 100 x 300 mm
(0.6 x 4.0 inches to 4.0 x 12.0 inches)
[hkstar.com/~dias]
Alphonsus Teo,
Regional Marketing Manager
[dias.na@home.com]
Dimensions: 1168 x 1143 x 1829 mm (46 x 45 x 72 inches)
ESC International
4 Ivybrook Blvd
Ivyland, PA 18974
Ph: 215.682.9300 ext. 15
Fax: 215.682.9318
Founded: 1980
ESC/Apollo 3000
July 2000
300 mm
1.8 sec
Yes
A
Yes
1.0-26.0 mm
18 x 88 mm to 76 x 260 mm
(0.7 x 3.5 inches to
3.0 x 10.0 inches)
[escint.com]
Bill Scheurer, Die Attach Equpment Sales Engineer
[bill@escint.com]
Dimensions: 1575 x 1320 x 2134 mm (62 x 52 x 84 inches)
ESEC
Hinterbergstrasse 32
6330 Cham, Switzerland
Ph: +1.480.893.6990
Fax: +1.480.893.6793
Founded: 1968
Micron 2
May 2000
200 mm
Varies
No A
No
0.5-20 mm
15 x 50 mm to 140 x 280 mm
(0.6 x 5.5 inches to
2.0 x 11.0 inches)
Dimensions: 1534 x 1955 x 1640 mm (60 x 77 x 65 inches)
Die Bonder 2008
August 1998
200 mm
Varies
Yes A
Yes
0.2-25.4 mm
9 x 120 mm to 75 x 260 mm
(0.35 x 4.72 inches to 2.95 x 10.23 inches)
Dimensions: 1280 x 1150 x 1750 mm (50.4 x 45.3 x 68.9 inches)
DB 2008 xP
August 2000
200 mm
Varies
Yes A
Yes
0.2-25.4 mm
9 x 120 mm to 90 x 270 mm
(0.35 x 4.72 inches to 2.95 x 10.23 inches)
Dimensions: 1280 x 1150 x 1750 mm (50.4 x 45.3 x 68.9 inches)
MRSI
101 Billerica Ave
North Billerica, MA 01862-1256
Ph: 978.667.9449
Fax: 978.667.6109
Founded: 1984
MRSI-375
May 1998
200 mm
1.8-2 sec
Option A
Yes
.10 mm (smallest)
25 to 140 mm
(1 to 5.5 inches)
[mrsigroup.com]
Daniel Crowley,
VP Sales and Marketing
[sales@mrsigroup.com]
Dimensions: 840 x 1120 x 1470 mm (33 x 44 x 58 inches)
MRSI-505
September 1996
200 mm
3-4 sec
Option A
Yes
.008 mm (smallest)
25 to 140 mm
(1 to 5.5 inches)
Dimensions: 840 x 1120 x 1470 mm (33 x 44 x 58 inches)
Palomar Technologies
2230 Oak Ridge Way
Vista, CA 92083
Ph: 760.931.3600
Fax: 760.931.5191
Founded: 1995 (Successor to Hughes Aircraft
Company’s Technology Products Division)
2470V
1995
200 mm
500 ms/wire
No A
N/A
N/A
304 x 127 mm
(12 x 5 inches)
[palomartechnologies.com]
[bonders.com]
Bruce Hueners,
Director of Marketing
[bwhueners@bonders.com]
Dimensions: 1220 x 810 x 1270 mm (48 x 32 x 50 inches)
3500-II
1996
200 mm
1200 cph
Option A
N/A
0.5-20 mm
Up to 305 mm
(Up to 12 inches)
Dimensions: 1520 x 1070 x 1880 mm (60 x 42 x 74 inches)
RD Automation
121 Ethel Road West
Piscataway, NJ 08854
Ph: 732.572.4800
Fax: 732.572.4808
Founded: 1969
CDB50-ST
October 1999
CDB-50R
April 2000
CDB-50
January 1999
150 mm (all)
Varies
Option S-A, A
No
0.2-25 mm
Up to 300 mm
(Up to 12 inches)
[rdautomation.com]
V.R. Saba,
Vice President–Marketing
[vickisaba@rdautomation.com]
Dimensions: 810 x 1170 x 1730 mm (32 x 46 x 68 inches)
 
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