Media Kit
For advertisements and demographics
click here
Current Advertisers
 Publisher's Letter
A Look Forward to the Year Ahead

 Assembly Lines
Pantronix Continues Expansion with Facility Planned for Shanghai, China

 Wafer Level Watch
The Allure of Parallel Processing: Defects Are Found Earlier, More Easily

 Harvey Miller's Notebook
Innovex and Substrate Technologies' Goal: Make Form Fit Function

 On Test

Credentials for Testing Are Escalating; Enter the Certified Smart Person (CSP)

 Flip-Chip Focus
Issues in Reworkable Underfills for Low-Cost Flip-Chip Applications

 Industry News
Company News
Research Reports
Packaging Foundries
People in the News
FSA 6th Annual Suppliers Day
Calendar of Events
Editorial Index

 Features
Forecast 2001
The Experts Look at the Issues

Demands for Higher Speed and Greater Accuracy Are Driving the Die Placement Equipment Market

Die Attach Equipment: What Packaging Foundries Want

CSPs Present New Challenges for Die Attach Equipment

How Bluetooth Packaging Choices Impact System Cost

Achieving High Accuracy and High-Throughput Assembly with Flip-Chip-on-Flex

Web-Based Collaborative IC Package Design

 Tutorial
An Overview of Flexible Printed Circuit Technology

 Technical Forum
How New Developments in Hydrofluorocarbon Cleaning Technology Impact Flip-Chip Package Production
Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder

 Tools & Technologies
Tray Changer Hikes Placement Productivity and more...

 Opinion
Something's Rotten in Stockholm: The Nobel Prize Committee and the IC

 Patents
Micro-Machined Wafer-Level Package Employs a Memory Wafer with a Silicon Nitride, SiO2 or SOG Passive Layer

 Archives
2001
Jan-Feb March April
May-June July  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription

 
This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
January - February 2001

Email the editor

FSA 6th Annual Suppliers Day

Fabless Suppliers Strut Their Stuff at Santa Clara Show

Santa Clara, Calif.-Bolstered by a prediction for a substantial increase in wafer consumption from the fabless sector, more than 100 companies exhibited at the Fabless Semiconductor Association's 6th annual FSA Suppliers Day.

Shortly before the October show, the FSA, headquartered in Dallas, announced that it expects wafer demand last year and this year to exceed earlier FSA forecasts.

The forecast, published in an update to the association's annual Wafer and Packaging Demand Survey, maintains that fabless companies would consume some 54 percent more wafers last year than in 1999, compared to earlier forecasts of 39 percent.

The FSA says that growth will continue this year, with a revised wafer demand forecast now estimated to be 55 percent higher than last year. This growth, according to the FSA, is consistent with revenue growth estimates for the public fabless segment of 57 percent in 2000.

"Growth for the fabless segment has not eased this year [2000], and we have no expectations of a slowdown in 2001," said Jodi Shelton, FSA's executive director. Shelton said the "FSA's biggest concern is that a wafer capacity shortage could stagnate this growth and, consequently, innovations." [fsa.org]

Ryusuke Matsuyama (left), Tadashi (Todd) Hattori and Katsuyuki Tarui (partially hidden) of Sharp, San Jose, discuss foundry services with Pekka Ojala, Exar Corp. Joan Bardach, president of Silicon Desert International, Mesa, Ariz., chats with old friend Bill de Carbonel, vice presidentÑmarketing of Adaptive Electronics, San Jose.
Jack Snyder, vice president of sales and marketing, Americas, for ASE (left), discusses test with Rick Crist, staff technical specialist - SABER of Schlumberger, Concord, Mass. Mary Finch, senior account manager, and C. Jack Martinson, director of sales and marketing for D2W design-to-wafer services, Fremont, Calif., discuss the foundry business with Hyunsik Ryu of Hyundai Semiconductor.
Joel Camarda (left), president of Flip Chip Technologies, talks business with Clint Jones, project manager, N-Able Group International, Fremont, Calif. Paul Smith (left), executive vice president of ASAT, Fremont, Calif., meets Sharone Zahavi of Global Factory, Santa Clara, Calif., and Dana Harris of AMCC (right).
Sunish Gupta of Amkor Technology Inc. (left) listens to Barney Hernandez of DuPont Photomasks, Round Rock, Texas. Tom Mordue, vice presidentÐworldwide test sales, ASAT Inc., (left) trades anecdotes with Tim Muth, vice president - supply management, Intersil, and Jeffrey Rogers, director of operations for Intersil's PRISM wireless products (right).
 
Copyright © 2001