Media Kit
For advertisements and demographics
click here
Current Advertisers
 Publisher's Letter
A Look Forward to the Year Ahead

 Assembly Lines
Pantronix Continues Expansion with Facility Planned for Shanghai, China

 Wafer Level Watch
The Allure of Parallel Processing: Defects Are Found Earlier, More Easily

 Harvey Miller's Notebook
Innovex and Substrate Technologies' Goal: Make Form Fit Function

 On Test

Credentials for Testing Are Escalating; Enter the Certified Smart Person (CSP)

 Flip-Chip Focus
Issues in Reworkable Underfills for Low-Cost Flip-Chip Applications

 Industry News
Company News
Research Reports
Packaging Foundries
People in the News
FSA 6th Annual Suppliers Day
Calendar of Events
Editorial Index

 Features
Forecast 2001
The Experts Look at the Issues

Demands for Higher Speed and Greater Accuracy Are Driving the Die Placement Equipment Market

Die Attach Equipment: What Packaging Foundries Want

CSPs Present New Challenges for Die Attach Equipment

How Bluetooth Packaging Choices Impact System Cost

Achieving High Accuracy and High-Throughput Assembly with Flip-Chip-on-Flex

Web-Based Collaborative IC Package Design

 Tutorial
An Overview of Flexible Printed Circuit Technology

 Technical Forum
How New Developments in Hydrofluorocarbon Cleaning Technology Impact Flip-Chip Package Production
Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder

 Tools & Technologies
Tray Changer Hikes Placement Productivity and more...

 Opinion
Something's Rotten in Stockholm: The Nobel Prize Committee and the IC

 Patents
Micro-Machined Wafer-Level Package Employs a Memory Wafer with a Silicon Nitride, SiO2 or SOG Passive Layer

 Archives
2001
Jan-Feb March April
May-June July  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription

 
This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
January - February 2001

Email the editor

People in the News

Torben Gronning Appointed to New Advantest America Post

Torben Gronning

Santa Clara, Calif.-Advantest America has appointed Torben Gronning to the newly created post of director of administration, reporting to president and CEO Nick Konidaris.

Based at the company's Santa Clara headquarters, Gronning will oversee IT, legal and human resource functions, and will also provide guidance to finance and sales administration.

Gronning is a native of Denmark, where he was most recently president and CEO of DELTA, a microelectronics consulting and service organization.

He holds an MBA from the Sloan School of Management at MIT and a master's degree in electrical engineering from the University of Denmark. [advantest.com]

Paul W. Smith Joins Carsem;Based in Scotts Valley Office

Scotts Valley, Calif.-Paul W. Smith has joined Ipoh, Malaysia-based packaging foundry Carsem as marketing director, based at the company's Northern California office.

Smith joined Carsem from ASAT Inc., Fremont, Calif., where he was executive vice president of worldwide marketing and e-business. [psmith@carsem.com]

Quad Systems Promotes Farragher to European GM

Stephen Farragher

Willow Grove, Pa.-Quad Systems Corp. has promoted Stephen L. Farragher to general manager and director of Quad Europe Ltd. (QEL), from European sales manager, stationed at High Wycombe, U.K.

Farragher joined QEL in 1997 as sales manager for Northern Europe. He earned a higher national diploma in electronics engineering and business studies from Leeds University, Yorkshire, England. [quad-sys.com]

 
Copyright © 2001