Flexible Circuits for High Density Applications Published by TechSearch International, Austin, Texas[techsearchinc.com] This report investigates the growing market for high-density interconnect flex circuits and provides a market forecast in volume (square meters) and by dollar value for each HDI flex application area. Feature sizes for HDI flex range from medical products with 50 micron lines and spaces and 50 micron vias with 200 micron capture pads, to inkjet printer cartridges with 75 micron lines and spaces. Wireless Communications: Winning Strategies for Outsourcing Published by Technology Forecasters Inc., Alameda, Calif. [techforecasters.com] This report indicates that major wireless companies are increasing the divestitures of manufacturing facilities to electronic manufacturing services (EMS) providers. Report topics include outsourcing of wireless products and changes likely by 2005, the impact of outsourcing on global competition and the effect facility acquisitions have had on name-brand suppliers and their contractors. |
