This month issue An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics January - February 2001 Email the editor

Tray Changer Hikes Placement Productivity

Siemens' Matrix Tray Changer for Siplace S-25 HM is a feed unit with an automatic magazine changer.

The Matrix Tray Changer (MTC) for the Siemens Siplace S-25 HM SMT placement system, a feed unit with an automatic magazine, is recommended for production facilities with a high output and a wide range of components.

The MTC consists of two independent towers, each with 40 levels consisting of four changer cassettes. Each also features a capacity of ten JEDEC trays.

The MTC is configured according to the set-up optimization specs, which ensures that the pick-up is performed from the two towers alternatively, which also defines an ideal pick-up sequence for the components.

During active operation, the selected magazine is automatically brought to the unloading level and moved into the exact position within the access range of the placement head. Each tower is equipped with its own drive.

Siemens AG, Nuremberg, Germany [nbgm.siemens.de]

Handler Tests 16 Memories Simultaneously

Advantest Corp. has introduced the M7341A Memory Module Handler, which allows for the simultaneous testing of up to 16 DIMM, RIMM or other memory modules while applying temperatures from -10°C to +125°C.

Introduced at SEMICON Japan, the unit employs a chamber construction that allows stable, high-temperature test over its standard temperature range. An option expands the low temperature application range to -40°C.

Compatible with a variety of memory modules, the M7341A can be used with a number of different memory modules and sizes, including 168-in DIMMS, Small Outline DIMMs used in notebook PCs and large DIMMs employed in workstations.

To ensure user safety, the M7341A features lock mechanisms on all doors, as well as an open door detector. Additionally, a hard interlock function interrupts power to the servomotor system when a door is opened.

The system offers an indexing time of 5s or less and a throughput of 1,700 or more modules when simultaneously testing 16 modules.

Advantest Corp., Tokyo [advantestamerica.com]

S.E.C. Option Provides Flip-Chip Removal

Semiconductor Equipment Corp. is offering the Model 870 attachment for the Model 850 die bonder. The attachment removes flip-chips that have been bonded using reworkable underfill materials.

The Model 870 includes a focused heat source for spot heating the flip-chip to melt the solder and break down the underfill. The attachment also offers a heated stage with substrate holder, which keeps the substrate flat and permits even heating of the bottom side of the substrate to prevent thermal shock and distortion.

Other features are a chip grabber for pulling/shearing-off the IC, a microscope with illuminator for alignment and a control box with power supply. The Model 870's temperature controller runs thermal profiles which can be controlled and saved on the controller.

The profiler reproduces the same thermal cycling employed during initial reflow of the flip-chip, via an oven.

Semiconductor Equipment Corp., Moorpark, Calif. [semicorp.com]

The S.E.C. Model 850 flip-chip bonder now offers an attachment for removing flip-chips that have been bonded with reworkable underfills.

New Software Features Added to Prophet

New software features have been added to KIC Thermal Profiling's Prophet Thermal Manager. The added features automate profiling by eliminating measurements during oven setup.

Other software functions include automatic profile alignment without measuring thermocouple positions, as well as automatic transfer and updating of set-points and belt speed after a recipe is loaded onto selected ovens.

User-selectable elements on print-outs and logging of alarm states in the events browser are also software enhancements.

KIC Thermal Profiling, San Diego, Calif. [kicthermal.com]

New Packages

ASAT Debuts Pb-Free TAPP Packages Fremont, Calif.-ASAT has introduced the TAPP (Thin Array Plastic Package), the newest member of the company's Kestral family of semiconductor packaging. According to the company, the TAPP "provides more connection points on a smaller, lighter, thinner lead-free package with excellent thermal and electrical characteristics." The TAPP is targeted at mixed signal applications, and employs a "pad frame" manufacturing concept that results in a high yielding, exceptionally robust and flexible package, ASAT says. TAPP is the result of a year's effort to develop solutions for smaller, more efficient products, according to ASAT. The new package is the first thin (maximum 0.8 mm) lead-free array package with an optional power/ground ring for enhanced electrical characteristics. It is available in multi-row and single-row formats and features a design that offers a very large, exposed die attach pad area, achieved by the use of saw singulation versus the more common stamped method. "Lead times to tool-specific options are only 7-9 days and will be done at no charge to our customers, thus avoiding expensive NRE tooling costs...," says Paul Smith, ASAT's executive vice president of world wide marketing and e-business. "In addition, TAPP is designed to be very easy to strip test." [asat.com] Cutaway view of TAPP illustrates "pad frame" concept. Microsemi Intros Si Detector in New Package Santa Ana, Calif.-Microsemi Corp. has released a silicon photoconductive optoelectronic detector, the first in a series of new products targeted for its patented Optomite package. The new package format is intended as an alternative to costly hermetic package formats, and for use in ultra-small handheld applications where board space is at a premium. [microsemi.com]

Agilent Intros High-Current Supply for 9300

Agilent Technologies has introduced a high-current device power supply (DPS) that will expand the processor testing capabilities for its 9300 Series SOC test system, while improving yield as a result of higher throughput and improved speed binning.

Rated at 100 A, and supporting ganging up to 200 A, Agilent's new DPS employs the same, single-board form in the test head as the existing general purpose DPS to provide what it terms "a cost-effective and compact way to specify or upgrade testers."

The new supply also offers low voltage droop and very fast response time for large changes in the current load.

The DPS features an on-board FIFO to store up to 32K of current measurements. A current monitor pin provides realtime waveform or analog output for immediate detection of anomalies in the current drawn by the DUT, using an oscilloscope or system digitizer.

The design also includes features to reduce risk to the DUT and test system components, while ensuring a safe operating environment. The supply is priced at $26,000.

Agilent Technologies, Palo Alto, Calif. [agilent.com]

Software Supports Coreco Frame Grabbers

Coreco Imaging, the recent merger of Coreco and Imaging Technology, has released Imaging Studio 5.0, a new machine vision software environment that provides comprehensive support for the company's frame grabbers.

The software combines a set of software libraries for machine vision applications development, including Coreco's IFC (Imaging Foundation Classes) ITEX Library and Camera Configurator.

Together, the software's imaging development kit offers a powerful, object-oriented application program interface for camera configuration, image acquisition and data display.

The software is available immediately and runs under Windows 98, Windows NT or Windows 2000.

Coreco Imaging, Bedford, Mass. [corecoimaging.com]

Burn-in System Handles 50W VLSI Chips

The HPB-3 Burn-in System is targeted for high-power VLSI devices up to 50W.

Micro Control's new HPB-3 high-power burn-in system is designed for the wide variations in heat dissipation created by VLSI devices up to 50W.

The unit can maintain active thermal control of each DUT to within ±plusmn;5°C over a programmable temperature range up to 150°C, while supporting a wide range of test strategies.

Features include ASIC architecture for per-pin timing, testing and formatting of pattern data, 600 amps of available DUT power per burn-in board and a 2-400 MHz programmable clock for device timing.

A fully configured HPB-3 accommodates 30 burn-in boards with 24 devices/board, for a total of 720 devices. Delivery is scheduled for Q2, with a base price is $600,000.

Micro Control Company, Minneapolis, Minn. [microcontrol.com]

Interface Pads Assist Thermal Management

3M is offering thermally conductive interface pads 5507 and 5507S, which serve as an interface material between heatsinks and electronic devices. The pads compliment 3M's existing line of thermal interface materials.

The new pads provide 5x the thermal conductivity of 3M's thermally conductive tapes, as well as gap-filling capability.

5507 is available in dual-linered sheets and 5507S features a thin polyimide carrier for improved handling and reworkability.

Each pad can be die-cut to fit nearly every application, according to 3M, and high conformabililty allows a single pad to be used over multiple components.

3M, St. Paul, Minn. [3m.com]