Current Issue The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging January - February 2002 Email the editor

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.

January 19-24 APEX 2002 Conference and Exhibit 19-24 Conference 22-24 Exhibits San Diego Convention Center 1.877.472.4724 [apex2002.org]

February 5-7 Seventh Annual Pan Pacific Microelectronics Symposium Westin Maui Hotel, Maui, Hawaii SMTA [smta.org] [kristen@smta.org] 5-7 SEMICON Korea COEX (Convention & Exhibition Centre) Seoul SEMI [semi.org] [semikorea.org]

March 1-3 International Workshop on Wafer-Level CSP and Flip Chip Packaging Packaging Research Center, Georgia Tech [prc.gatech.edu] 3-6 Burn-in & Test Socket Workshop (BiTS) Hilton Mesa Pavillion Hotel, Mesa, Ariz. IEEE [bitsworkshop.org] 10-13 ICAPS - International Conference on Advanced Packaging and Systems Reno Hilton Hotel, NV IMAPS [imaps.org] 24-28 IPC Printed Circuits Expo 2002 Convention Center, Long Beach, Calif. IPC [ipc.org] 26-27 SEMICON China Shanghai SEMI [semi.org]

April 3-4 Canadian High Technology Show International Centre, Mississauga, Toronto, Canada REC [reedexpo.ca.hightech] 9-12 NEPCON Microelectronics Shanghai Everbright Convention and Exhibition Centre Reed Exposition Companies [nepconchina.com] 16-18 SEMICON Europa 2002 New Munich Trade Fair Centre, Germany SEMI [semi.org] 17-19 2002 International Conference on Electronics Packaging (ICEP) and 16th Microelectronics Show Tokyo, Japan IMAPS [imaps.org] 29-30 Advanced Technology Workshop on Ceramic Applications for Microwave and Photonic Packaging Westin Providence Hotel, Rhode Island IMAPS [imaps.org]