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 Publisher's Letter
A Year of Uncertainty and Opportunity Opens

 Assembly Lines
The Curtain Rises on a Recovery Year

 Electronic Trends
High-Performance Substrate Volumes Continue Growing

 Wafer-Level Watch
Semiconductor Heavyweights Are Preparing Wafer-Level Game Plan

 Packaging Insights
The Trend Toward Copper Metallization with Low-K Dielectric Layers Continues

 On Test
Terror on the Test Floor - Are You Ready?

Opto-Electronically Speaking
I Have Returned - Can We Talk?

 The View from Europe
Europe's Future Role in IC Packaging

 Industry News
Company News
People in the News
Packaging Foundries
Asia & Europe
Opto/Nanotechnology
Calendar of Events
Editorial Index

 Features
Cover Story: Dispensing Equipment Trends - Accuracy and Cost of Ownership Are the Buywords
Dispensing Equipment Vendor Chart

Achieving Optimal Dam-and-Fill Dispensing in a High-Mix BGA/CSP Environment

Precision Needle Dispensing - Get to the Point!

South Korea: One of Asia's New Technology Leaders

Backgrinding Fabrication for Thin-Wafer Production

 Tutorial
Stencil Printing Basics: Equipment, Materials and Process Requirements

 Technical Forum
How Plasma-Enhanced Surface Modification Improves the Production of Microelectronics and Optoelectronics

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MARKEM Introduces Indirect Laser Film Marking System and more...

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Patent Forms ICs with Gold Bumps Using Standard TAB

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
January - February 2002
Dispensing Equipment Vendor Chart
ASYMTEK  
2762 Loker Ave. West, Carlsbad, CA 92009
Phone: 1.800.ASYMTEK Fax: 431.2678
Founded: 1983 www.asymtek.com
Debbie Bernath, Manager, Customer Service info@asymtek.com
Additional Offices

Phone: +31(0)43.352.4466 Fax: +31(0)43.363.7722 Europe
Phone: +81(0)3.576.2801 Fax: +81(0)3.576.2802 Japan
Phone: +82.31.766.8321 Fax: +82.31.766.8320 Korea
Phone: +65.778.2511 Fax: +65.778.3151 S.E. Asia
Phone: +886.2.2902.1860 Fax: +886.2.2902.1859 Taiwan

Model: Axiom X-1020 Intro: Sept. 2001 In-line
Footprint: 1100 x 1443 mm (43" x 57")* Principal Use: Production
 
Applications: Dam and fill, encapsulation, silver epoxy lines and dots, underfill Automated
Dispense Area: 432 x 452 mm (17" x 18") Pump-configuration dependent
 
Vision System: Enhanced PR with red/blue LEDs Windows NT
Unique Features: CAN bus structure with local P control
Model: Century Series C-720 Intro: July 1999 Stand Alone
Footprint: 1041 x 843 mm (41" x 33") Principal Use: R&D, Prototype  
Applications: Dam and fill, encapsulation, underfill Semi-auto
Dispense Area: Dispense Area: 432 x 356 mm (17" x 14") Valve dependent
 
Vision System: Vision System: PR with die corner finding Windows NT
Unique Features: Proprietary mass-flow calibration (MFC) automatically compensates for fluid-viscosity changes
Model: Century Flux C-730 Intro: Nov. 1999 Inline
Footprint: 1041 x 914 mm (41" x 36") Principal Use: Production
 
Applications: Selective fluxing Automated
Dispense Area: 508 x 365 mm (20" x 14") Application/option dependent
 
Vision System: Targeting offset camera and PR system available Windows NT
Unique Features: Co-axial air feature with DispenseJet, removes fluxing from placement system for efficiency
Model: Millennium M-2020 Intro: July 2001 Inline
Footprint: 1579 x 1160 mm (62" x 46") Principal Use: Production
 
Applications: Conductive epoxy, dam and fill, encapsulation, SMT adhesive, etc. Automated
Dispense Area: 435 x 535 mm (17" x 21") Pump-configuration dependent  
Vision System: PR with die corner finding Windows NT
Unique Features: Closed-loop DC servo motion control, proprietary MFC, high-capacity, optional dual-lane conveyor

CREATIVE AUTOMATION COMPANY (Dispensing Division)
11641 Pendleton St., Sun Valley, CA 91352
Phone: 818.767.6220 Fax: 818.767.1243
Founded: 1968 www.creativedispensing.com
Gary Helmers, Vice President
Dispensing Division
sales@creativedispensing.com
Model: Champion 8300 Intro: Dec. 2000 In-line
Footprint: Not Supplied Principal Use: Production
 
Applications: Dam and fill, encapsulation, underfill Auto/Stand Alone
Dispense Area: 457 x 508 mm (18" x 20")  
Vision System: Feature recognition MS-DOS
Unique Features: Digital dispensing with pixel size down to 0.005 in.
Model: Champion 3700 Intro: Dec. 1999 Stand Alone
Footprint: Not Supplied Principal Use: Production, R&D  
Applications: Dam and fill, encapsulation, underfill Auto/Stand Alone
Dispense Area: 457 x 457 mm (18" x 18")  
Vision System: Feature recognition Windows NT
Unique Features: Digital dispensing with pixel size down to 0.005 in.

DIAS AUTOMATION–NORTH AMERICA (Division of DIAS Automation Hong Kong Ltd.)
Unit A7, 3d Floor, Block A, Merit Industrial Bldg.,
94 Tokwawan Rd., Kowloon, Hong Kong
Phone: 604.527.4180 Fax: 604.527.4182
Alphonsus Teo, Regional Mktg. Mgr.
dias.na@shaw.ca
www.diasautomation.com
Model: AD-33 Intro: Jan. 2000 Inline or Stand Alone
Footprint: 1092 x 2007 mm (43" x 79") Principal Use: Not Supplied  
Applications: Dam and fill, sealing, underfill Automated
Dispense Area: 457 x 508 mm (18" x 20")  
Vision System: PR Windows NT
Unique Features: SMEMA-compatible, accurate dispensing system with universal handler

GPD GLOBAL
2322 I-70 Frontage Rd., Grand Junction, CO 81505
Phone: 970.245.0408 Fax: 970.245.9674
Founded: 1974 www.gpd-global.com
Christian Vega,
Business Development Manager
cvega@gpd-global.com
Model: MicroMax Series Intro: Sept. 2000 Both
Footprint: 927 x 1194 mm (36" x 47") Principal Use: Production  
Applications: Encapsulation, microdot dispensing, SMT adhesive, solder paste, underfil Both avail.
Dispense Area: 305 x 305 mm (12" x 12") w/ two valves, camera and surface sensor  
Vision System: AutoVision Windows-compatible QNX realtime O/S
Unique Features: Compact footprint, micro volumes, next-generation compatible
Model: DS Series Intro: Jan. 1995 Both
Footprint: 1168 x 1067 mm (46" x 42") Principal Use: Production (larger substrates)  
Applications: Encapsulation, microdot dispensing, SMT adhesive, solder paste, underfill Both avail.
Dispense Area: 457 x 457 mm (18" x 18") w/ one valve, camera and surface sensor  
Vision System: AutoVision Windows-compatible QNX realtime O/S
Unique Features: Micro-volume capable, large work area

MRSI GROUP
101 Billerica Ave., Bldg. 3, North Billerica, MA 01862
Phone: 976.667.9449 Fax: 978.667.6109
Founded: 1984 www.mrsigroup.com
Data not supplied

SPEEDLINE TECHNOLOGIES INC. (CAMALOT Division)
16 Forge Park, Franklin, MA 02038
Phone: 508.541.4895 Fax: 508.541.3061
Founded: 1987 www.speedlinetechnologies.com
Krista Fabian,
Public Relations Manager
kfabian@speedline.cookson.com
Model: XyflexPro Small Intro: 2000 Inline
Footprint: 787 x 1268 mm (31" x 50") Principal Use: High-volume production  
Applications: Adhesives, encapsulation, epoxy, solder paste, underfil Automated
Dispense Area: 330 x 254 mm (13" x 10")  
Vision System: PR Windows NT
Unique Features: High-accuracy microdot capability, mass measurement process control
Model: XyflexPro Large Intro: 2000 Inline
Footprint: 991 x 1575 mm (39" x 62") Principal Use: High-volume production  
Applications: Adhesives, dam and fill, encapsulation, epoxy, solder, underfill Automated
Dispense Area: 508 x 559 mm (20" x 22")  
Vision System: PR Windows NT
Unique Features: Mass measurement process control, high-accuracy microdot dispensing
Model: Xyflex Intro: 1999 Inline
Footprint: 2226 x 1748 mm (88" x 69") Principal Use: High-volume production  
Applications: Adhesives, dam and fill, encapsulation, underfill Automated
Dispense Area: 330 x 254 mm (13" x 10")  
Vision System: PR Windows NT
Unique Features: Four independently controlled gantries for highest throughput
Model: Vortexx Intro: 1999 Not supplied
Footprint: 864 x 1372 mm (34" x 54") Principal Use: Tessera µBGA production  
Applications: Encapsulation and underfill of µBGA packages Not supplied
Dispense Area: Standard Type IV µBGA package  
Vision System: N/A N/A
Unique Features: Void-free vacuum-injected underfill, low cost of ownership
This listing is based on data supplied by the individual manufacturers, but is not meant to be all-inclusive as to product or company. Chip Scale Review assumes no liability for omissions, typographical errors or misprints. For most current information, please contact the manufacturer. Boldface type indicates issue advertiser.
 
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