MARKEM Introduces Indirect Laser Film Marking System MARKEM Corp., Keene, N.H., has introduced the Model U-1478Q indirect laser film marking system, targeted at the optoelectronics industry. The heart of the machine is MARKEM's Q-2001 Optimark print engine, which is designed to include the best features of traditional ink marking and direct laser marking. The print engine employs a CO2 laser to transfer ink from a film onto the device. The U-1478Q also includes a semiautomatic parts-handling system, capable of handling most optoelectronic parts with simple fixtures. Changeover can be accomplished in a matter of seconds, according to the company. [markem.com] New Underfill Sticks to Flip Chips Dexter Electronic Materials, a division of Loctite Corp., Industry, Calif., has introduced Hysol FP4549FC, a package-level underfill designed to offer excellent adhesion to flip-chip assemblies containing a wide variety of no-clean flux residues. Qualified to perform in 260° reflow applications, the underfill heat cures in 30 minutes at 165°C and meets JEDEC Level-3 260°C requirements. [dexelec.com] Production Solutions Unit Speeds Setup with MPM Stencil Printer Production Solutions Inc., Poway, Calif., has introduced the Red-E-Set substrate support system for use with MPM's Model SPM semiautomatic stencil printers. With the unit, every part of the PWB is supported throughout the screen-printing cycle. The Red-E-Set supports the components already placed on the board, as well as the board itself. [production-solutions.com]
Qualitek Announces New No-Clean Formula Solder Paste Qualitek International, Addison, Ill., has added Qualitek 888 formula 691 no-clean solder paste to its lineup. The paste incorporates a combination of hot slump resistance material with a new activator blend, claimed to eliminate mid-chip beading and micro-solder balling. Suitable for pin-in-paste applications, formula 691 is 100 percent ICT pin probable and will reflow with or without nitrogen. The formula is available with lead-containing alloys or in a lead-free compound. [qualitek.com]
DL Technology's DispenseLink Targeted at HDI, ICs and SMT DL Technology LLC has introduced the DispenseLink controller for cost-effective micro-volume dispensing. The unit is targeted for applicatioins in high-density interconnection, SMT and IC packaging. The DispenseLink provides totally programmable increment and velocity control for the DL Micro Valve on any standard dispensing platform, enabling dot arrays, lines, fill routines and custom patterns at material volumes of less than 10 mils. [dltechnology.com] Polyclad Laminates Inc. Introduces TURBO 371 Material Polyclad Laminates Inc., Londonderry, N.H., has introduced TURBO 371, a laser drillable laminate and prepreg system. The enhanced e-glass reinforced FR-4 materials are specifically engineered for HDI applications requiring laser-drilled HDI layers. [polyclad.com] Anza Technology Announces Tabletop Automatic Bonders Anza Technology, Roseville, Calif., has introduced the Model 275, the first thoroughly ESD-protected, manual to fully automatic, high-resolution tabletop ultrasonic bonder available for under $55,000, according to the company. Placement accuracy is given at under 5 microns, with ESD levels claimed to be less than 2 percent of competitive units. The Model 275 accepts standard 0.5" and 2" spools of diameter 0.0007" to 0.002" insulated or bare Au, Ag, Pt and Ai wire, and uses any standard bonding tools. A large, alphanumeric keypad and backlit display allow easy progamming. Measuring only 12" H x 21" W x 17.5 D" the unit is priced from $35,000-55,000, depending on options. [anzatech.com] CDS, Optimal Corp. Release 'Signal Integrity' Module CAD Design Software, Santa Clara, Calif., has released "Signal Integrity," a new add-on module for its line of advanced IC packaging software. The software incorporates a state-of-the-art simulation engine developed by Optimal Corp. Signal Integrity users, according to the company, can easily study all aspects of a package's electrical performance, including resistance, inductance, capacitance and conductance, crosstalk, s-parameter, impedance, ground bounce and noise. [cad-design.com] Benchtop Plasma System Offers Compact Design and Flexibility The new Model PE-200 by Plasma Etch Inc., Carson City, Nevada, fits on a benchtop and measures only 30" W x 34" D x 26.5" H. System specifications include patented absolute process temperature control, electrostatic vacuum chamber shielding, loading flexibility and reactive ion etching capabilities. [plasmaetch.com] Simotec Debuts 'Intelligent' Die Bonder with High UPH Simotec, Munich, Germany, says it has taken a modular approach to electronic assembly and die bonding with its ModulAS system. The machine can achieve a throughput of up to 7,200 UPH, twice the speed of conventional systems; claimed to be a speed record for flip-chip applications. The company says the basic modules and elements of the ModulAS are designed to permit the configuration of a single system or any desired combination of systems. The machine offers reduced cost of ownership, because only the main module controls the production line, as opposed to conventional systems that require a complete control system in every new machine. [simotec.com] DCI Announces Model 1560 Thermal Control Socket System Dimensions Consulting Inc. (DCI), Santa Clara, Calif., a subsidiary of Credence Systems Corp., has introduced the Model 1560 Thermal Control Socket System for IC package characterization. DCI claims the system enables the characterization of ICs in substantially less time than traditional forced-air thermal control systems. The unit integrates a miniature thermal electrical cooler into the test socket lid, which allows for device package temperature control within a -15° to +125°C range, with 0.1 degree resolution and up to 60W cooling. The system's adjustable temperature range enables engineers to adjust and monitor device temperatures more accurately, according to DCI. [dci-us.com] |
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