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January - February 2003
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
January - February 2003
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Publisher's Letter
Hello to 2003 - are you ready for the new year?
Assembly Lines
Despite a recession, top 5 IC packaging foundries retained their 2001 rankings
Opto-Electronically Speaking
Researchers at IBM's Almaden research center making nanometer-scale circuits
Harvey Miller's Notebook
Emerging interconnection technologies ready for future electronic markets
Packaging Matters!
Squeezing profits back into packaging
Industry News
Company News
Opto/Nanotechnology
Packaging Foundries
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Features
Dispensing for Area Array Devices: The Technology is Evolving into Tools Suitable for Larger, Higher I/O Die
Dispensing Equipment Vendor Directory
How Long Will Your Test Boards and Sockets Last?
Why Wafer Probing Is a Critical Technology for the Semiconductor Manufacturing Test Floor
Contact Resistance: a Potential Source of Problems
Overview of Wafer-Applied Underfill Activities: How to Turn Flip Chip's Drawback's into Benefits
Tools & Technologies
Dual DUT Probe Card Allows at-Speed Test and more...
Patents
Invention describes how to form wafer-level hermetic packages
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