Nextek Inc. Adds Two New VPs and Director of Engineering Madison, Ala.-Nextek Inc. has added two vice presidents and a director of engineering to its executive staff. Charles L. Perry has joined the company as vice president and chief operating officer. He most recently served as a senior manager with Deloitte Consulting, New York. His industry experience includes posts at Allied Signal, Chrysler Corp., ITT Industries and Schlumberger. Mark S. Edwards has joined the company as vice president of sales, reporting to Charles Perry. He replaces Richard Savas, who retired. Richard B. "Rick" Gunn has joined Nextek as director of engineering, reporting to John Roberts, vice president of operations. [nextekinc.com]
After Viko Acquisition, Infiniti Solutions Ltd. Plans Expansion Singapore-Infiniti Solutions Ltd. plans to establish a global assembly and test business with over $60 million in sales within a year. The company recently acquired Viko Technology, which Infiniti said is the second largest independent IC prototype test company in the U.S. Infiniti is led by entrepreneur/engineer Inderjit Singh, CEO. Infiniti acquired Viko after successfully securing a $36 million loan from venture capitalists and 3i, EDB Investments, a private equity firm. "Our goal from day one has been clear-to become the Flextronics of the test and assembly industry," Singh said. Singh said that the Viko acquisition "kick-starts" Infiniti's international strategy, and gives Infiniti an "immediate presence" in Silicon Valley and Austin, Texas. Infiniti also maintains two design centers in India. [infinitisolutions.com]
Pac Tech USA Offering Contract Wafer Bumping, Stencil Services Santa Clara, Calif.-Pac Tech USA has begun offering contrtact wafer bumping and solder-stencil printing services at a new facility within the company's U.S. headquarters, 328 Martin Ave. Equipment will include the PacLine 2000 A50, which is capable of bumping 600K wafers/year, according to Dr. Thorsten Teutsch, CTO. Pac Tech will employ its new SB2-Jet solder ball equipment for solder ball bumping at the facility. [pactech.de] SESA Becomes North American Distributor for Fujitsu Handlers Santa Clara, Calif.-Semiconductor Equipment Sales Associates Inc. (SESA), has been appointed the North American distributor for next-generation test handlers developed by Fujitsu Tohoku Electronics, Japan. The machines were developed by Fujitsu for in-house use, but have now been released for use by semiconductor makers worldwide. [sesa.com] Speedline Files Suit Against Ekra Franklin, Mass.-Cookson Electronics Equipment, under its legal name Speedline Technologies, has filed a patent infringement suit against Ekra America Inc., in the Federal District Court in Boston. The suit claims Ekra infringed Speedline's patents 5,060,063, 5,807,606 and 5,873,939. The patents relate to vision alignment, vision inspection and the use of dual tracks, respectively, in stencil printers. [cooksonelectronics.com] FormFactor Launches Asia Service Center in Seoul, Korea Livermore, Calif.-FormFactor, a wafer probe card maker, has opened an Asia Service Center in Seoul, Korea. The center will supply regional probe card repair and replacement for customers in Japan, Korea, the Philippines, Singapore and Taiwan. The company says the Korean center "is the first of a worldwide network of on-site support teams and regional service centers" planned. [formfactor.com] Endicott Interconnect Completes Buyout of IBM Facility, Operations Endicott, N.Y.-Endicott Interconnect Technologies Inc. (EIT), has completed its acquisition of IBM's Endicott facility and the operations located there. The deal was announced in July 2001. EIT is a private company formed through a partnership of local investors who bought the IBM operation for $65 million. The company said it will keep about 2000 employees. IBM has also agreed to lease back 1.4 million square feet of the campus for 10 years to house some 2000 workers in IBM's ongoing operations at the site. The remaining vacant real estate will be leased. Among the products slated for production at EIT is the HyperBGA package, now marketed by EIT as a stand-alone package product line.
Atlantic Technology Appoints Belmeguenai Quality Director Crumlin, S. Wales-Packaging foundry Atlantic Technology has appointed Salem Belmeguenai quality director reporting to Jeff Baloun, CEO. Belmeguenai most recently worked for ASAT in Nancy, France, and earlier with ST Microelectronics. [atlantic1.co.uk] August Technology Wins China Order Minneapolis-August Technology Inc. has received an order from Ace Semicon-ductor, Shanghai, China, for a 3Di automated wafer and bump inspection system. [augusttech.com] Oppert Joins EKRA in New Business Unit Manager Position Boennigheim, Germany-Thomas Oppert has joined EKRA GmbH, a stencil and screen printer manufacturer, in the new post of business unit manager worldwide for its advanced packaging business unit. He reports to Roland Heynen, EKRA's executive vice president. Oppert was most recently vice president of marketing and sales at Pac Tech GmbH in Berlin, Germany. Oppert earned a master's degree in electrical engineering with a specialization in semiconductor technology from the Technical University of Berlin. [ekra.com] |
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