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 Publisher's Letter
Hello to 2003 - are you ready for the new year?

 Assembly Lines
Despite a recession, top 5 IC packaging foundries retained their 2001 rankings

 Opto-Electronically Speaking 
Researchers at IBM's Almaden research center making nanometer-scale circuits

 Harvey Miller's Notebook
Emerging interconnection technologies ready for future electronic markets

 Packaging Matters!
Squeezing profits back into packaging

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Dispensing for Area Array Devices: The Technology is Evolving into Tools Suitable for Larger, Higher I/O Die
Dispensing Equipment Vendor Directory

How Long Will Your Test Boards and Sockets Last?

Why Wafer Probing Is a Critical Technology for the Semiconductor Manufacturing Test Floor

Contact Resistance: a Potential Source of Problems

Overview of Wafer-Applied Underfill Activities: How to Turn Flip Chip's Drawback's into Benefits

 Tools & Technologies
Dual DUT Probe Card Allows at-Speed Test and more...

 Patents
Invention describes how to form wafer-level hermetic packages

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January - February 2003
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
People in the News

Chip Supply Promotes Hamby, Hernandez to Expanded Roles

Orlando, Fla.-Chip Supply Inc. has promoted Cynthia (Cyndy) Hernandez to vice president-operations and Tony Hamby to marketing and sales director.

Hernandez was formerly vice president of sales and marketing. Prior to joining Chip Supply, she worked at Siliconix for six years. She earned a bachelor's degree from Vassar College and an MBA from the University of Phoenix.

Hamby was formerly strategic marketing manager and acting southeast regional sales manager. Hamby received a bachelor's degree from Florida State University and a MBA from Rollins College. [chipsupply.com]

IPC Presents Underwood 'Hall of Fame' Award at '02 Meeting

Northbrook, Ill.-The IPC presented Ron Underwood its Raymond E. Pritchard Hall of Fame Award, the group's highest form of recognition, at its 2002 annual meeting in New Orleans.

Underwood was recognized for his long-term contributions to the organization and the industry. He served as a member of the IPC board for more than 20 years. He also served as a member of the IPC's policy committee and currently represents the group in the World Electronics Circuits Council. [ipc.org]

Gordon Moore

SIA Honors Dr. Gordon Moore for His Lifetime Achievement

San Jose-The Semiconductor Industry Association has honored Dr. Gordon E. Moore, co-founder and chairman emeritus of Intel Corp., with the SIA's Lifetime Achievement Award. SIA President George Scalise called Dr. Moore "an innovator and industry legend. He is a superb leader, motivator, businessman, philanthropist and educator." [sia-online.org]

Eagle Electronics Names Erickson President of IC Interconnect Unit

Colorado Springs, Colo.-Curt Erickson has been promoted from vice president to president of IC Interconnect, a wafer-bumping service provider and subsidiary of Eagle Electronics.

Prior to joining ICI, Erickson spent 15 years with Delco Systems and Delco Electronics in several posts. He holds degrees in materials and mechanical engineering from the University of Wisconsin, Milwaukee. [icinterconnect.com]

Demmin Joins Tessera Tech as Director of Product Marketing

San Jose-Jeffrey C. Demmin has joined Tessera Technologies Inc. as director of product marketing, reporting to Craig Mitchell, vice president of marketing.

Demmin was most recently editor-in-chief of Advanced Packaging magazine. He holds a bachelor's degree in physics from Princeton University and a master's degree in materials science from Stanford University. [tessera.com]

JEDEC Award Given to Koscal

City of Industry, Calif.-Glenn Koscal, director of technical sales for Carsem, was recently presented a JEDEC Chairman's Award. Koscal received the award for his contributions in chairing the JC-11.2 Design Guide Task Group for new packages. [carsem.com]

Marinelli Appointed to New Henkel Loctite Engineering Post

City of Industry, Calif.-Chris Marinelli has been appointed director of applications engineering, a new position, for Henkel Loctite's Electronics Business Unit.

He joined the company in 1973 and has held engineering posts of increasing responsibility.

Marinelli was most recently associate director of application engineering for electronics assembly products. He holds a bachelor's degree in industrial technology from Central Connecticut State Univer-sity. [loctite.com]

Six Sigma Relocates to New Facilities

Milpitas, Calif.-Six Sigma, a provider of lead finish, BGA reballing and other packaging services has relocated to a new, 24,000-square-foot facility at 905 Montague Expressway. [solderquik.com]

Aaron Saxton

Universal Instruments Promotes Saxton to Development Position

Binghamton, N.Y.-Universal Instruments has promoted Aaron Saxton to business development manager for midrange products.

Saxton joined UIC in 1999 and has held several other posts within the company. Earlier, he served as a process engineer at Lockheed-Martin's Center of Excellence for Electronics Assembly in Florida. He earned bachelor's and master's degrees in industrial engineering from Rutgers University. [uic.com]

 
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