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 Publisher's Letter
Hello to 2003 - are you ready for the new year?

 Assembly Lines
Despite a recession, top 5 IC packaging foundries retained their 2001 rankings

 Opto-Electronically Speaking 
Researchers at IBM's Almaden research center making nanometer-scale circuits

 Harvey Miller's Notebook
Emerging interconnection technologies ready for future electronic markets

 Packaging Matters!
Squeezing profits back into packaging

 Industry News
Company News
Opto/Nanotechnology
Packaging Foundries
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Calendar of Events
Editorial Index

 Features
Dispensing for Area Array Devices: The Technology is Evolving into Tools Suitable for Larger, Higher I/O Die
Dispensing Equipment Vendor Directory

How Long Will Your Test Boards and Sockets Last?

Why Wafer Probing Is a Critical Technology for the Semiconductor Manufacturing Test Floor

Contact Resistance: a Potential Source of Problems

Overview of Wafer-Applied Underfill Activities: How to Turn Flip Chip's Drawback's into Benefits

 Tools & Technologies
Dual DUT Probe Card Allows at-Speed Test and more...

 Patents
Invention describes how to form wafer-level hermetic packages

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January - February 2003
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
Tools & Technologies
The P4 cards can probe Al, Cu and Au pads or bumps.

Dual DUT Probe Card Allows at-Speed Test

Kulicke & Soffa Inc., Willow Grove, Pa., has introduced two additions to its P4 family of fine pitch probe cards. A dual-DUT card permits simultaneous, at-speed testing of two die. A dual-row staggered card has been designed for probing staggered bond pads.

K&S claims the P4 technology for wafer probing can "significantly decrease the cost of test." [kns.com]

The Palomar 3470-II is targeted to aerospace and military applications.

Industry's Largest Wedge Bonding Area

Palomar Technologies, Vista, Calif., has introduced the 3470-II automatic wire bonder for high-performance, first-level, Au/Al wire interconnect assembly in military or aerospace applications.

The unit enables deep access edge bonds across the industry's largest bonding area of 4089cm2 with 0.006353mm accuracy and "exceptional control and repeatably." [bonders.com]

The IS-1000 video inspection system for BGAs

Video Inspection Systems Aimed at Ball Grid Arrays

ASG, a Division of Jergens Inc., Cleveland, Ohio, has announced a family of three new BGA inspection systems.

The new IS-1000 video inspection systems provide a non-destructive method of inspecting hidden solder joints. The units can assist in the reduction of field failures while detecting defects other methods can't reliably find.

New Cam Lid Stops Damage to Package Lids

Aries Electronics Inc., has introduced a line of high frequency test sockets with a new CAM lid that helps eliminate damage to package pads.

The lid can be employed on both double-latched and hinged designs in any of Aries' high frequency test sockets. [arieselec.com]

The CAM lid is for use with Aries' high-frequency test sockets. DL's "No-Drip" cartridge

Dispense Valve Cartridge for Low Viscosity Fluids

DL Technology, Haverhill, Mass., has introduced the No-Drip dispense valve cartridge for dispensing flux, underfills and encapsulants. [dltechnology.com]

SolVision Gets System Order

SolVision Inc., Longueuil, Quebec, Canada, has received an order for its "NANO 3D" solder bump inspection system from a large semiconductor maker. [solvision.net]

The model DV509 diaphragm enables micro-shot sizes.

Diaphragm Valve Dispenses Low-Medium Viscosity Fluids

I&J Fisnar Inc., Fair Lawn, N.J. , has introduced the model DV509 diaphragm valve for dispensing low-medium viscosity fluids. It offers the advantage, says Fisnar, of keeping the wetted parts separated from the operating air supply.

This attribute is particularly useful when dispensing cyanoacrylates, reagents, UV adhesives and volatile substances, Fisnar claims. [ijfisnar.com]

Silver-Filled Polyimide Offers Many Applications

Creative Materials Inc., Tyngsboro, Mass., has announced Creative Materials 122-47, a single component, silver-filled, electrically conductive polyimide die attach adhesive.

In addition to die attach, the formula is suitable for several other uses, including PC board fabrication. [creativematerials.com]

New Equipment Extends State-of-Art at Plastronics Socket

Plastronics Socket Co., Irving, Texas, has added a Wasino CNC grinder and a Mitsubishi Wire EDM machine to its mold tooling facility.

The additions will enable socket molds to be built with "50 millionths" precision levels according to the company. For enhanced inspection, Plastronics also added a Nikon Video Measuring System VM-250. [plastronicsusa.com]

The Rudolph Technologies WaferView system

Automated Macro-Defect Inspection System Intro'd

Rudolph Technologies Inc., Flanders, N.J., has introduced the WaferView, an automated after-develop wafer-inspection system for 200/300mm wafers.

The unit allows fully automated IC or WLP macro defect inspection by inspecting 100 percent of the wafer surface at throughputs greater than 100wph. WaferView's full-color technology and image processing will detect 95 percent of photolithography defects and will correctly classify them 85 percent of the time, according to Rudolph. [rudolphtech.com]

Newport Corp.'s 1930IS Fiber-Optic Power Meter

Optical/Fiber-Optic Power Meter Family Announced

Newport Corp., Irvine, Calif., has announced a family of five optical power meters designed for CW free space and fiber-optic power measurements. The meters offer advanced features and options for laser power measurements in test, manufacturing and research applications for semiconductor and new component technology development in telecom and datacom segments.

The 1930IS Fiber-Optic Power Meter features built-in integrating spheres, large dynamic range and high sensitivity with fiber-optic connectors mounted directly on the front panel. [newport.com]

Optical CD Measurement Module Useful for WLP

Tokyo Electron Limited, Tokyo, has introduced an optical critical dimension (OCD) measurement module for use in coater/developers suitable for IC fabrication and WLP processes. As wafer diameters increase, processing and inspection automation is needed.

The OCD module employs Optical Digital Profilometry (ODP), developed by Timbre Technolo-gies Inc., a U.S. subsidiary of TEL. [tel.co.jp]

 
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