The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

Archives >> January - February 2004 issue
January - February 2004
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.

• Dispensing Trends in Chip-Scale Packaging

• Digital Dispensing for Chip-Scale Packaging

• Dispensing Dot Size Is Constantly Shrinking

• Productivity Gains Needed in Dispensing Systems

• Equipment Must Satisfy Future Requirements

• International Directory of Dispensing System Vendors

• Thermal Management: Smaller, Faster, Hotter!

• Building Small: Notes from a MEMS Watcher

• System-on-Package Integrates Multiple Tasks

• Flip-Chip Underfill: Design and Material Challenges

• Demystifying Chip Manufacturing in China

Table of Contents

• Publisher's Letter: Wafer-level packaging conference announced

• Assembly Lines: Finally, there's light at the end of the tunnel

• Trendlines: '04 - the year of wafer-level packaging?

• On Test: Shotgun wedding needed: BIST and ATE

• Electronic Trends: IC unit growth 'outstanding' in '03, should continue in '04

• Industry News

• Calendar

• Tools & Technologies

• Patent Review: A useful answer to fragile leadframes

• Ad Index

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ASXAdvanced Semicond4.721.51
AEHRAehr Test Systems0.770.00
AMKRAmkor Technology6.071.34
AMATApplied Materials12.791.19
ASMIASM International35.053.27
CSCDCascade Microtech3.630.00
IMOSDIMOSD0.000.00
INTCIntel Corporation26.741.75
KLACKLA-Tencor Corpor51.980.87
KLICKulicke and Soffa11.632.11
LRCXLam Research Corp44.19-0.72
NEWPNewport Corporati19.492.31
NDSNNordson Corporati47.903.03
QCOMQUALCOMM Incorpor61.060.54
RTECRudolph Technolog10.831.21
STSensata Technolog31.001.74
SPILSiliconware Preci5.47-0.91
STMSTMicroelectronic7.010.29
TGALTegal Corporation3.120.00
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