January - February 2006
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
Featured Articles
• Dispensing, Encapsulating and Underfilling: Picking the 'Right' Equipment for the Job
• International Directory of Dispensing System Vendors
• How Flip-Chip Package Interactions Affect the Manufacture of High-Performance ICs
• Combining Two Acoustic Microscope Modes Provides a Way to Disclose Flip-Chip Defects
Table of Contents
• Publisher's Letter: Keeping step with the global markets
• Assembly Lines: IC package assembly is now a global industry: Can Dubai or India trim China's sails?
• Test Patterns: Cheaper testers, more fault coverage
• In Retrospect: OSAT industry chalked-up 15% growth
• Electronic Trends: Packaging the bionic person
• Calendar
• Inside Patents: Major U.S. patent law changes likely by Congressional action
• Ad Index
| CSR Stock Index | |||
| Symbol | Name | Last | Pct Change |
| ASX | Advanced Semicond | 4.72 | 1.51 |
| AEHR | Aehr Test Systems | 0.77 | 0.00 |
| AMKR | Amkor Technology | 6.07 | 1.34 |
| AMAT | Applied Materials | 12.79 | 1.19 |
| ASMI | ASM International | 35.05 | 3.27 |
| CSCD | Cascade Microtech | 3.63 | 0.00 |
| IMOSD | IMOSD | 0.00 | 0.00 |
| INTC | Intel Corporation | 26.74 | 1.75 |
| KLAC | KLA-Tencor Corpor | 51.98 | 0.87 |
| KLIC | Kulicke and Soffa | 11.63 | 2.11 |
| LRCX | Lam Research Corp | 44.19 | -0.72 |
| NEWP | Newport Corporati | 19.49 | 2.31 |
| NDSN | Nordson Corporati | 47.90 | 3.03 |
| QCOM | QUALCOMM Incorpor | 61.06 | 0.54 |
| RTEC | Rudolph Technolog | 10.83 | 1.21 |
| ST | Sensata Technolog | 31.00 | 1.74 |
| SPIL | Siliconware Preci | 5.47 | -0.91 |
| STM | STMicroelectronic | 7.01 | 0.29 |
| TGAL | Tegal Corporation | 3.12 | 0.00 |
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