The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

January - February 2007
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company152.100.72
AMKRAmkor Technology5.97-2.29
AMATApplied Materials21.34-0.63
EMNEastman Chemical75.771.68
HONHoneywell Intl.95.590.57
NEWPNewport Corp.17.03-9.99
NDSNNordson Corp.75.590.48
RTECRudolph Tech8.72-2.57
STSensata Tech47.590.85
SMGZYSmiths Group PLC18.432.11

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