The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

January - February 2007
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company142.19-0.16
AMKRAmkor Technology8.90-1.44
AMATApplied Materials21.750.05
EMNEastman Chemical82.38-0.35
HONHoneywell Intl.93.530.25
NEWPNewport Corp.17.41-0.57
NDSNNordson Corp.76.860.40
RTECRudolph Tech9.09-0.55
STSensata Tech45.96-1.01
SMGZYSmiths Group PLC20.27-0.69

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