The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

January - February 2007
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company144.50-0.07
AMKRAmkor Technology9.960.91
AMATApplied Materials22.201.37
EMNEastman Chemical81.99-0.04
HONHoneywell Intl.95.940.18
NEWPNewport Corp.19.061.11
NDSNNordson Corp.79.800.09
RTECRudolph Tech9.630.10
STSensata Tech49.760.26
SMGZYSmiths Group PLC21.750.18

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