The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

January - February 2007
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
MMM3M Company143.71-0.53
AMKRAmkor Technology9.09-0.75
AMATApplied Materials22.070.09
EMNEastman Chemical82.990.07
HONHoneywell Intl.93.92-0.77
NEWPNewport Corp.18.06-0.66
NDSNNordson Corp.78.83-0.50
RTECRudolph Tech9.33-0.64
STSensata Tech47.490.17
SMGZYSmiths Group PLC21.94-1.26

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