The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

January - February 2007
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company148.592.44
AMKRAmkor Technology7.560.13
AMATApplied Materials20.990.45
EMNEastman Chemical77.56-0.56
HONHoneywell Intl.94.701.20
NEWPNewport Corp.17.96-1.70
NDSNNordson Corp.73.950.79
RTECRudolph Tech8.86-1.23
STSensata Tech46.331.11
SMGZYSmiths Group PLC18.570.68

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