Editor Editoral eMail the Editor

Features Is 1999 'The Year of the Chip-Scale Package'? With at least 100 CSP formats being readied to enter the market, OEMs, end users and manufacturers wonder if this is the "breakthrough" year for chip-scale. Ron Iscoff, Editor HDI Substrates Enable Future Electronics When will the American Organic Substrate (Printed Circuit Board) Industry climb aboard the Microvia/Build-up Train? Harvey S. Miller, Contributing Editor Technical Forum Microvia Technology: The Key to Using CSPs Adam T. Singer , IBIS Associates, Inc., Wellesley, Mass. Chip-Scale Package Offers Cost Savings for Development of Cellular Video Conferencing Avner Badihi, ShellCase Ltd., Jerusalem, Israel