Media Kit
For advertisements and demographics
click here
 
 Current Advertisers

List of the sponsors

 Publisher's Letter
Some Thoughts about Golf
 
 Assembly Lines
Y2K Thoughts: To Look Forward, You Have to Look Back!
 
 Electronic Trends
Area Array Package I/O Pitch Will Continue to Decline
 
 Small Talk
Is Flip-Chip a Case of the Right Technology Before Its Time?
 
 Wafer - Level Watch

`One-Size-Fits-All' Thinking Must Change for Wafer Level

 
 Harvey Miller's Notebook
It's a New Market Phase for Flex-Based Semiconductor Packages
 
 On Test
Test Process Choices Influence Cost, Throughput and ATE Design
 
 Industry News
Get Higher Yields or Your Money Back!
Merger of AMT, Hana Creates $300 Million Company
People in The News
Company News
Calendar of Events
 
 Features
The Bandwagon Starts to Roll for Lead-Free Electronics
A Primer on Lead-Free Solder
Lead - Free Chip-Scale Soldering of Packages
A Period of Adjustment
An Expert Looks at the Issues™
Integrated Assembly and Strip Test of Chip-Scale Packages
Dispensing Equipment: Getting Smarter and More Automated
Are Chip-Scale Packages and Known-Good Die Competitors or Teammates?
Site Synergy and Short Cycle Times Drive Advanced Packaging in Europe
 
 Contacts
Industry Contacts
 
 Opinion
As Device Complexity Increases, Final Test Grows in Importance
 
 Patents
Patent Employs Modified TAB Technology to Produce CSPs
 
 Tools & Technologies
Dynacraft Offers Low-Cost CSP Leadframe and more
 
 Archives
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec

  Subscription
Free U.S. Subscription Form


 
 
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March - April 2000

Email the editor

 Calendar of Events

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsoring organizations. Please fax your listing at least one month in advance of issue date to the Editor at 209.824.2799. You may also e-mail your listing to chipscale@cs.com.

MARCH

14-16

APEX
Long Beach, Calif.
IPC/SMEMA
20-24

PCB Design Conference West
Santa Clara (Calif.) Convention Center
Miller Freeman Inc.

APRIL

4-6

IPC Printed Circuits Expo

San Diego (Calif.) Convention Center
4-6 SEMICON Europa 2000
Munich, Germany
SEMI
17-19 MicroMaterials Conference
"MicroMat 2000"

Berlin
Fraunhofer IZM
17-21 Process Certification and Defect Recognition
National Training Center for Microelectronics Northampton Community College (also 5-22-5-26-00 in San Diego, Calif.)
ntcinfo@northampton.edu
[northampton.edu]
24-28 2000 Materials Research Society Meeting
San Francisco
Materials Research Society
26-28 HD International
Adams Mark Hotel, Denver
Miller Freeman Inc.

MAY

3-4

NEPCON Philadelphia
King of Prussia, Pa.
Reed Expo
8-9

2000 European VLSI and Microsystems Packaging Workshop
Cork, Ireland
IEEE CPMT Society

9-11 SEMICON Test, Asembly and Packaging 2000
Singapore
SEMI
21-24 Electronic Components and Technology Conference
Caesar's Palace, Las Vegas, Nevada
IEEE
JUNE

13-14

NEPCON East
Boston
Reed Expo

SMT/ES&S/Hybrid 2000 Conference Slated for June 27-29

Nuremberg, Germany-The SMT/ ES&S/Hybrid 2000 conference is set for June 27-29 at the Nuremberg (Germany) Exhibition Centre. The annual event will also feature an extensive tutorial program and exhibits, in addition to the conference.

Dr. Herbert Reichl of the Fraunhofer Institute for Reliability and Microintegration, Berlin, is the conference chairman. The conference organizer is the MESAGO International Business and Technology Group, Stuttgart, Germany. [mesago.de/smt]

 
 
  Copyright (C) 2000