Media Kit
For advertisements and demographics
click here
 
 Current Advertisers

List of the sponsors

 Publisher's Letter
Some Thoughts about Golf
 
 Assembly Lines
Y2K Thoughts: To Look Forward, You Have to Look Back!
 
 Electronic Trends
Area Array Package I/O Pitch Will Continue to Decline
 
 Small Talk
Is Flip-Chip a Case of the Right Technology Before Its Time?
 
 Wafer - Level Watch

`One-Size-Fits-All' Thinking Must Change for Wafer Level

 
 Harvey Miller's Notebook
It's a New Market Phase for Flex-Based Semiconductor Packages
 
 On Test
Test Process Choices Influence Cost, Throughput and ATE Design
 
 Industry News
Get Higher Yields or Your Money Back!
Merger of AMT, Hana Creates $300 Million Company
People in The News
Company News
Calendar of Events
 
 Features
The Bandwagon Starts to Roll for Lead-Free Electronics
A Primer on Lead-Free Solder
Lead - Free Chip-Scale Soldering of Packages
A Period of Adjustment
An Expert Looks at the Issues™
Integrated Assembly and Strip Test of Chip-Scale Packages
Dispensing Equipment: Getting Smarter and More Automated
Are Chip-Scale Packages and Known-Good Die Competitors or Teammates?
Site Synergy and Short Cycle Times Drive Advanced Packaging in Europe
 
 Contacts
Industry Contacts
 
 Opinion
As Device Complexity Increases, Final Test Grows in Importance
 
 Patents
Patent Employs Modified TAB Technology to Produce CSPs
 
 Tools & Technologies
Dynacraft Offers Low-Cost CSP Leadframe and more
 
 Archives
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec

  Subscription
Free U.S. Subscription Form


 
 
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March - April 2000

Email the editor

 Company News

DCI Acquires Test Sockets Maker Liberty Research Inc.

Santa Clara, Calif.-Dimensions Consulting Inc. (DCI) has acquired Liberty Research Inc., a Santa Clara-based maker and supplier of test and burn-in sockets.

Effective with the acquisition, Liberty Research management and personnel became a business unit of DCI.

DCI specializes in engineering, design, PWB fabrication, assembly and test. Nick Langston Sr., founder and president of Liberty, has been named Liberty product line manager for sockets, reporting to DCI President Zaid Ayoub.

Explaining the reason for the acquisition, Ayoub said,"The synergy between DCI's and Liberty's product lines will allow us to provide an expanded range of products and services to our joint customers."

Zaid Ayoub

"We look forward to growing our new part of DCI's business-high-performance sockets," said Langston. "As part of DCI, we will be able to compete more effectively and respond to market conditions more rapidly." [dci-us.com]

Nick Langston Sr.

ASE, OSE Order More K&S Model 8028 Ball Bonders

Taiwan -Advanced Semiconductor Engineering (ASE) has placed orders with Kulicke & Soffa Industries for K&S Model 8028 ball bonders worth $44 million, representing the Willow Grove, Pa. firm's largest 8028 order.

Orient Semiconductor Electronics Ltd., meanwhile has ordered 300 K&S Model 8028 bonders for its production facility in Kaoh-siung, Taiwan. The bonders for ASE and OSE will ship during this fiscal year.

The machines destined for ASE will be employed for the production of high leadcount plastic BGA packages

K & S 8028 Ball Bonders

N.C. Chiang, vice president of IC assembly operations for OSE, said the bonders will be used to support a continuing ramp-up in the production of semiconductors packaged in plastic BGAs.[ase.com] [ose.com.tw]

Fairchild Semi Moves to Larger Maine Quarters

South Portland, Maine-Fairchild Semiconductor International, a direct descendent of Silicon Valley's most famous startup with 8,400 employees, has moved its corporate headquarters to a larger building here.

Fairchild became an independent company in March 1997, and has since acquired Raytheon Semiconductor in Mountain View, Calif., and the Power Device Division of Samsung Electronics in Puchon, S. Korea.

Chip Scale Review Applies for Business Membership in BPA

New York-Chip Scale Review has applied for business membership in BPA International, a worldwide circulation auditing organization.

BPA International will verify circulation for Chip Scale Review based on demographic and geographic coverage.

"Chip Scale Review has grown in a remarkably short time to become the leading publication serving the advanced IC assembly and packaging world," notes Publisher Gene Selven. "The BPA International audit will provide our advertisers with the assurance that their hard-earned advertising dollars are reaching the audience that authorizes, specifies and buys their products."

The audit will be completed over the next 1.5 years. [chipscalereview.com] [bpai.com]

TRW Group Demonstrates World's Fastest Digital Chip

Redondo Beach, Calif.-The TRW Space & Electronics Group has demonstrated the world's fastest digital IC, a frequency divider operating at a clock frequency of 69 GHz (69 billion cycles/second).

The chip was made using Indium Phosphide, an advanced semiconductor material with high-speed performance superior to silicon or gallium arsenide, and described at December's IEDM Conference.

Dwight Streit, director of TRW telecom products, said digital logic operating at speeds greater than 60 GHz is essential for telecom applications such as 40 Gb/second fiber optic chip sets and advanced frequency synthesizers.

Photo shows pedestal-like collector layer of TRW digital circuit.


The TRW circuit was fabricated using Indium Phosphide heterojunction bipolar transistors. A unique feature of these transistors, according to TRW, is the removal of collector material beneath the base layer, which results in a cantilevered base layer resting on a pedestal-like collector layer.[trw.com]

ASAT Ltd. Financial Restructuring Completed

Hong Kong-The financial restructuring of IC packaging foundry ASAT Ltd. has been completed, the company announced recently.

Under the new ownership structure, ASAT is 50% owned by QPL, former majority owner, and 50% owned by a financial investor group led by Chase Asia Equity Partners. The investors are Olympus Capital and Orchid Asia.

T.L. Li continues as ASAT's chairman, while Jerry Lee assumes operating responsibilities on a day-to-day basis."It's been a tremendous year," said Dick Brancato, president of ASAT USA, Fremont, Calif. "The whole team has worked hard to turn ASAT around and get back to its roots of providing leading edge technology with a superior customer service quotient." [asat.com]

Speedline, Universal Will Market Unicam Software

Speedline Technologies and Universal Instruments have announced separate agreements to resell Technomatix Technologies' factory software.

The Franklin, Mass.-based Speedline, a division of Cookson Group plc., said it will market Technomatix' Unicam software to Speedline's existing customer base.

"Unicam software offers our customers a single manufacturing engineering solution for all assembly machines, including pick-and-place systems," said Russell Schlager, Speedline's vice president of marketing.

Universal Instruments, Binghamton, N.Y., will resell Unicam software for optimization and offline programming of Universal's GSM platform, other surface mount applications and through-hole assembly equipment. [speedlinetechnologies.com]

IDI Wins Technology Award

Kansas City, Kan.-Interconnect Devices Inc. (IDI) received the "Technology of the Year" Award for the ICT probe from the Silicon Prairie Association.

The award was presented recently during the Silicon Prairie Assocation's sixth annual awards ceremony convened to honor the best innovations in Kansas City technology. [idinet.com]

Tecan Components Opens U.S. Subsidiary

Oriskany, N.Y.-Tecan Components of Weymouth, England, is now offering its electroformed stencil technology through its new U.S. subsidiary, Chepaume Industries, here.

The office is located at 6001 Airport Rd., Oriskany, NY 13424, phone 315.768.7001. [chepaume.com]

Call for Information on IC Packaging Foundries

The July-August (SEMICON/West) issue of Chip Scale Review will present a major article on IC packaging foundries, including an extensive vendor listing.

If you provide IC assembly services and have not received a call letter, please contact the editor by March 31 at chipscale@cs.com to ensure your free listing.


next 
 
 
  Copyright (C) 2000