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| Dispensing Equipment:
Getting Smarter and More Automated |
Dispensing
has become a both critical and sensitive part of the CSP fabrication
process, due to the many variables involved in using encapsulants
and underfills.
Dispensing gear, which can be in-line or stand-alone
(or both), is part of a rapidly growing market for CSP capital equipment.
A major breakthough is dispensing systems was
the vacuum dispensing of encapsulants for CSPs of several years
ago.
Since the earliest dispensing systems arrived
on the scene-"oldest" being about four or five years in the past-dispensing
machines have become more flexible, more automated and more crucial
to turnout out a solid, void-free package.
"Throughput is the name of the game in CSP underfill
and encapsulation," according to Dr. Rao Mahidhara, Chip Scale Review's
contributing technical editor. "That is followed by cost of ownership."
High-throughput systems are expensive, due to their newness on the
market, Dr. Mahidhara says. "As CSPs grow and the equipment becomes
more mature, we should see less costly equipment with improved features
and even better throughput.
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Figure
1. This
Asymtek DP-3000 linear pump is shown dispensing underfill
material.
Flexibility is not a chief concern, Dr. Mahidhara
says. "Most dispensing systems today can accommodate many
CSP sizes with relatively simple adjustments."
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The U.S. market leaders in gantry-sized dispensing
systems are Nordson's Asymtek, Carlsbad, Calif. and Cookson's Speedline
CAMALOT Division of Haverhill, Mass. A distant third in the domestic
market are such companies as Phase 2 Automation, Fremont, Calif.,
and Han-Mi of Inchon, Korea.
Philip J. Davies, president of Allteq Industires,
Fremont, Calif., says "We have seen that our fully automated table
top systems have been the most economical choice for most of our
customers, but the need for large gantry-type systems is obviously
there." This is a market, Davies adds, "that we are looking at closely."
Looking at the leaders today, however, Asymtek's newest model for
encapsulation and underfill, the Century C-720, is a batch system
configurable for single- and dual-valve dispensing. The high dispensing
flow rate is better than 1% at 3 sigma, when equipped with the
Asymtek's linear positive displacement pump.
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Figure
2. The
CAMALOT Vortexx™ was designed specifically for vacuum-assisted
injection of underfill and encapsulants of µBGA strips for
the Tessera Type IV process.
Competitor CAMALOT's Vortexx (formerly named
the Model 3950), which was co-developed with Tessera, was
designed to encasulate the Tessers µBGA package using a vacuum-assisted
injection technique.
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Vacuum injection, according to CAMALOT, offers
enhanced material flow, allows for a higher number of devices per
strip, more compact device designs and faster process time. Additionally,
the Vortexx improves tape utilization and sports a lower equipment
cost. A dual-head option doubles the throughput in units per hour.
As machine features are enhanced-and the CSP
market develops at least a veneer of maturity, we can expect equipment
prices to drop-or perhaps only to stabilize-as suppliers rush to
keep up with the growth in dispense technology required by new package
types.
Ron Iscoff
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Suppliers
Of Dispensing Systems*
|
| Supplier |
Model#
Introduced
|
Dimensions
(LxWxH)
(I)nline
or (S)tandalone
|
Primary
Uses
(A)uto,
(S)emi, or (M)anual
|
Features
Offshore
Contacts
|
Allteq
Industries Inc.
930 Amburn Court Fremont,
CA 94538 510.770.8181 510.656.1591
(fax)
Phil Davies, President
sales@allteq.com
www.allteq.com
|
L1502e
1997
|
24
in. (610 mm)
x 33 in (838 mm).
x 14 in (355 mm).
(S)Tabletop
|
Underfill, encapsulation, dam and
fill, die overcoating
(A)
|
Single magazine input, fully
automated material handleing, 2 in.
x 2 in. dispense area for leadframes
or Auer boats, CE approved.
China
(HK) +852.267.94085
Philippines
+632.812.4808
Taiwan
+886.35.725325
S.E.
Asia +60.4.6414134
|
|
L1510
1997
|
24
in. (610 mm)
x 33 in (838 mm).
x 14 in (355 mm).
(S)Tabletop
|
Die coating, filling (production
leadframe products) single-dot applications
(A)
|
Single magazine input for leadframes
or Auer boats. Fully automatied material handleing, CE approved. |
Asymtek,
a Nordson Company
2762 Loker Ave. West
Carlsbad, CA 92008
800.ASYMTEK
760.431.2678 (fax)
Debbie Bernath,
Manager, Customer Service
www.asymtek.com
|
Century
C-720
July
1999
|
41
in. (1041 mm)
x 33 in (838 mm).
x 56 in (1443 mm).
(S)
|
Production and R&D underfull, encapsulation,
dam and fill
(S)
|
Fluid mass flow calibration station,
(patented) and heated vacuum plate
Europe
+31(0)43.352.4466
Japan
+81(0)3.576.2801
Korea
+82.347.766.8321
Taiwan
+886.2.8200.1268
S.E.
Asia +65.778.2511
|
|
Millennium
M-600
February
1996
|
45
in. (1137 mm)
x 33 in (864 mm).
x 49 in (1237 mm).
Both
available
|
Production, R&D underfull, encapsulation,
dam and fill
(A)
|
Fluid mass flow calibration station |
|
Millennium
M-2000
February
1999
|
62
in. (1579 mm)
x 42 in (1067 mm).
x 52 in (1334 mm).
(I)
|
Production underfill, encapsulation, dam and
fill
(A)
|
Closed-loop DC servo motion control,
fluid mass flow calibration station |
Han-Mi Mold & Tool Co.,
Ltd.
532-2 Kajwa-Dong
Inchon 404-250, Korea +82.32.577.9751 +82.32.578.9753 (fax)
www.han-mi.co.kr
|
Data
not available at presstime |
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Speedline Technologies CAMALOT,
145 Ward Hill Ave., Haverhill, MA 01835 978.373.3742
978.521.2105 (fax)
Bruno Miquel
Product Marketing Mgr. www.speedlinetechnologies.com
|
CAMALOT
3950 Vacuum Injection System for BGA Encapsulation
March
1999
|
54
in. (1373 mm)
x 36 in (914 mm).
x 57 in (1448 mm).
Both
available
|
Vacuum encapsulation of BGA packages |
UK
+44(0)118.930.1432
Fax
+44(0)118.90.1445
Asia
+65.286.6635
Fax
+65.289.9411
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| *Note:
This is not all-inclusive. |
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