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This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March - April 2000
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Publisher's Letter
Some Thoughts about Golf
Assembly Lines
Y2K Thoughts: To Look Forward, You Have to Look Back!
Electronic Trends
Area Array Package I/O Pitch Will Continue to Decline
Small Talk
Is Flip-Chip a Case of the Right Technology Before Its Time?
Wafer - Level Watch
`One-Size-Fits-All' Thinking Must Change for Wafer Level
Harvey Miller's Notebook
It's a New Market Phase for Flex-Based Semiconductor Packages
On Test
Test Process Choices Influence Cost, Throughput and ATE Design
Industry News
Get Higher Yields or Your Money Back!
Merger of AMT, Hana Creates $300 Million Company
People in the News
Company News
Calendar of Events
Features
The Bandwagon Starts to Roll for Lead-Free Electronics
A Primer on Lead-Free Solder
Lead - Free Chip-Scale Soldering of Packages
A Period of Adjustment
An Expert Looks at the Issues™
Integrated Assembly and Strip Test of Chip-Scale Packages
Dispensing Equipment: Getting Smarter and More Automated
Are Chip-Scale Packages and Known-Good Die Competitors or Teammates?
Site Synergy and Short Cycle Times Drive Advanced Packaging in Europe
Contacts
Industry Contacts
Opinion
As Device Complexity Increases, Final Test Grows in Importance
Patents
Patent Employs Modified TAB Technology to Produce CSPs
Tools & Technologies
Dynacraft Offers Low-Cost CSP Leadframe and more
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