An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics March - April 2000 Email the editor

Dynacraft Offers Low-Cost CSP Leadframe

Dynacraft Industries recently added the DMF (Dynacraft Micro Frame) to its product line. MDF, according to the company, will provide a low-cost solution for high-density, low leadcount packages.

The MicroFrames are available in standard Ag plate or NiPdAu plating, and are claimed to reduce board space by greater than 50% over comparably leaded SOIC, SSOP, TSOP, TSSOP and TQFPs.

Dynacraft says the MicroFrames are well suited to applications in high frequency, portable, wireless and small-size products.

Assemblers who use the Dynacraft DMF product will require only one mold design for several package sizes and leadcounts.

Dynacraft Industries, 1230 Oakmead Parkway, Suite 312, Sunnyvale, CA 94086, 408.328.0520, fax 408.328.0530.

[dynacraft.com]

AI Technology Debuts New Adhesives

AI Technology Inc. recently introduced several new adhesives for electronics. The company's ME8418-DA, a silver epoxy die-attach adhesive, is designed to cure at temperatures of 80-120^oC.

The adhesive is ambient storable for more than seven days without greater than 10% deviation from the 20,000 cps viscosity. At a temperature of 90^oC, the bonding cycle is complete in less than 30 minutes and ready for wire bonding at temperatures as high as 250^oC, according to AI Technology.

Resin bleeding has been reduced to a negligible level compared to some traditional die attach adhesives, AI says.

The company has also announced the availability of adhesive film for backside and flip-chip die attach.

Designated ESP8680-WL and ZEF8150-WL, both films are dry to the touch and ambient storable for more than a year. They require minimal pressure using either standard wafer/frame film applicators or heated rubber roll laminators to achieve void-free tacking of the adhesive onto the wafer at 80-100^oC.

Once cooled to the ambient temperature, the wafer with film adhesive may be mounted onto wafer dicing tape for standard dicing operations. The adhesive remains with the dies when picked from the mounting tape.

ESP8680-WL is designed for both large and smaller dies. The ZEF8150-WL is manufactured for flip-chip applications with anisotropic conductive properties.

AI Technology Inc., 70 Washington Rd., Princeton, NJ 08540, 609.799.9388, fax 609.799.9308, ait@aitechnology.com.

[aitechnology.com]

Gel-Frames Optimize Die Sorting/Bonding

Gel-Frames, a die carrier recently introduced by Gel-Pak, optimize die sorting and bonding equipment by enabling the handling of multibin parts.

The Gel-Frames are laminated onto a membrane, which can be assembled to any standard dicing frame, including those for 300 mm wafers. The result is a Gel-Frame that can store a large custom array of die and is compatible with any assembly equipment. Figure 1. Gel-Frames optimize die sorting and bonding equipment

The frame can release the die via standard pin ejection with reduced force or by employing Gel-Pak's vacuum release technology.

The company claims that die chipping can be eliminated since the flexible wafer frame format allows die to be placed in the best configuration for the assembly equipment type being used.

Gel-Pak, 756 N. Pastoria Ave., Sunnyvale, CA 94086, 408.733.1313.

NanoVia Will Focus on Microvias

NanoVia LP has been formed to exploit an inventive optical method of creating laser microvia at high speed. The company was funded by a group of Redmond, Wash. investors, and is headed by CEO S. Collar Waters, a venture capitalist from the Philadelphia area.

NanoVia will debut its first product, the NV3950 for microvia drilling, in April at the IPC PC Expo.

The company says it will offer turnkey processing solutions that include material handling for web, TAB tape, wafer and panel-formatted materials.

NanoVia, 4 Delta Drive, Suite 6, Londonderry, NH 03053, 603.421.0713, fax 603.421.0214.

[nanovia.com]

JNJ Introduces New Stencil Cleaner

JNJ Industries has introduced a new ultrasonic stencil cleaning system, the AquaSonic AQS-7000 that offers increased process control and superior cleaning performance.

The system features a touch screen operator interface that allows operators to control every aspect of the machine's operation, including automatic lift assembly, wash, rinse and drying time, percentage of cleaning power and heating.

Unlike other systems that rinse by immersing the stencil into a semi-contaminated dip tank, the AQS-7000's rinse chamber boasts 40 spray nozzles that rinse both sides of the stencil simultaneously.

Standard machine features include 4,000 watt heaters, 2,000 watt, 40 kHz ultrasonic cleaning with integral sweep and pulse ultrasonic generation aa well as all stainless steel construction.

JNJ Industries Inc., 195 E. Main St., Milford, MA 01757, 800.554.9994.

PPT Vision Debuts Machine Vision System

PPT Vision has debuted the Scout 1, a complete turnkey, one-camera machine vision system with the flexibility to be upgraded to a two or four camera system. Figure 2. Scout 1 turnkey vision system

The Scout 1 consists of an integrated high-speed processor, 15 inch SVGA monitor, camera and lighting system, keyboard, tackball, cables and the Vision Program Manager software. The company claims users can set up a comprehensive inspection program for any application.

PPT Vision, 12988 Valley View Rd., Eden Prairie, MN 55344, 612.996.9500.