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 Publisher's Letter
Some Thoughts about Golf
 
 Assembly Lines
Y2K Thoughts: To Look Forward, You Have to Look Back!
 
 Electronic Trends
Area Array Package I/O Pitch Will Continue to Decline
 
 Small Talk
Is Flip-Chip a Case of the Right Technology Before Its Time?
 
 Wafer - Level Watch

`One-Size-Fits-All' Thinking Must Change for Wafer Level

 
 Harvey Miller's Notebook
It's a New Market Phase for Flex-Based Semiconductor Packages
 
 On Test
Test Process Choices Influence Cost, Throughput and ATE Design
 
 Industry News
Get Higher Yields or Your Money Back!
Merger of AMT, Hana Creates $300 Million Company
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The Bandwagon Starts to Roll for Lead-Free Electronics
A Primer on Lead-Free Solder
Lead - Free Chip-Scale Soldering of Packages
A Period of Adjustment
An Expert Looks at the Issues™
Integrated Assembly and Strip Test of Chip-Scale Packages
Dispensing Equipment: Getting Smarter and More Automated
Are Chip-Scale Packages and Known-Good Die Competitors or Teammates?
Site Synergy and Short Cycle Times Drive Advanced Packaging in Europe
 
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 Opinion
As Device Complexity Increases, Final Test Grows in Importance
 
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Patent Employs Modified TAB Technology to Produce CSPs
 
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Dynacraft Offers Low-Cost CSP Leadframe and more
 
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March - April 2000

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  Get Higher Yields or Your Money Back!

Hook our air ionizer to your assembly gear and banish leadframe particulates.

The Allteq System 888 cleans leadframes while it controls static discharge.

Unlike ceiling-mounted ionizers, the System 888 works right at the process point-where it will do the most good!

And we can quickly and inexpensively Þt the system directly to your die or wire bonders, inspection stations or molding equipment. Or we can supply you with a fully automatic cleaning system.

Bill (front) and Phil

We're so sure that you'll see a dramatic yield improvement, that we offer this iron-clad, 60-day guarantee: If you're not satisÞed with the results, return the system to us for a full refund.

While we can't predict your actual yield gain, in many cases, the savings alone will pay for the System 888 in as little as six weeks-depending on the value of your Þnished chips!

As the leaders in post-wirebond inspection stations, proprietors Bill and Phil know dirt and how it ruins ICs. Allteq's System 888 gets rid of junk like packing foam, paper fiber, skin, hair, dust, loose bonding wire and many others.

At under 25 pounds, the System 888 occupies less space than a desktop computer.

The System works by employing a delicate stream of ionized air that discharges static from the package and frees particles from the IC.

System 888

These particles are pulled into the unit's Þltered box under vacuum by a self-contained, oil-less vacuum unit driven by a maintenance-free pump.

The captured, particulate-laden air is drawn through a 0.3 micron HEPA filter, and the clean air is recirculated into the room.

Fed from an ultra-clean gas source, the System's ionizing unit typically operates at 10X greater than Class 1 cleanroom requirements.
Cleaning Head

For the full story, phone Allteq Industries today at 510/770-8188. Or get more info at banishdirt@allteq.com. Because dirt belongs outside, not on your process line!

Visit Allteq Industries at www.allteq.com.
 
 
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