Universal Offering Fully Integrated Systems Universal Instruments, Binghamton, N.Y., is forging a closer relationship with Dover sister companies DEK and Vitronics Soltec to offer complete, fully integrated assembly systems. The systems incorporate software, screenprinters, board handling, ovens and any other necessary equipment or services, in addition to Universal's pick-and-place machines. Initially, Universal is offering systems configured for certain types of manufacturing, including high-volume/low-mix environments, medium-volume/medium-mix settings, medium-volume/medium-mix environments and low-volume/high-mix lines. [uic.com] LPKF Introduces Stencil Inspection Modules LPKF, Wilsonville, Ore., has introduced the QuickCheck and QuickView, fully integrated add-ons to LPKF's StencilLaser systems. Both enable users to inspect the quality of metal or polymer stencils immediately after they have been produced. Both systems employ a CCD camera installed in the StencilLaser's cutting head. QuickView is a process visulatization and targeting system. QuickCheck performs precise measurements of indivdual stencil aperatures for wall smoothness, geometry and diameter. [lpkfcadcam.com]
Omron Announces Solder Inspection System Omron Electronics Inc., Schaumburg, Ill., has announced a new automated solder and component inspection system, the Model VT-RABBIT, for PWB quality control applications. The unit employs Omron's patented color highlight technology to locate hard-to-detect solder defects and component irregularities that other grayscale processors miss. The system claims to consistently identify defects at a rate of 250 ms per field of view. [omron.com]
PMJ Unveils HiSAC Cell with LeadScan PMJ Automec USA Inc., Grand Prairie, Texas, has unveiled its HiSAC 1500 odd-form cell with LeadScan. The HiSAC 1500, which now incorporates the LeadScan Sensing System, offers on-the-fly inspection of odd-form, through-hole components. LeadScan can detect bent and/or missing leads prior to component insertion, regardless of the number of leads, lead shape or profile. [pmjusa.com]
Stencil Printer Is Aimed at Ultrafine-Pitch SMT The MPM Division of Speedline Technologies has released the Ultraprint 1500 stencil printer for board manufacturing environments processing ultrafine-pitch SMT products. The Ultraprint 1500 combines a base platform with many cost-effective options and product improvements that are easily configured to process both SMIT and non-SMT boards. The unit will handle boards up to 22 inches x 20 inches. Standard Features include MPM's patented automatic board-to-stencil alignment, a self-leveling dual squeegee print head, programmable hard board stops and a Microsoft Windows NT operating system. An enhanced 2-D print verification system enables automatic verification of print quality on freshly painted boards. To increase printer uptime, a support pin placement system within the UP1500 automatically places support pins in a programmable pattern to ensure a flat board-support surface. [speedlinetechnologies.com] ELECTROVERT Intros Laser Soldering System The ELECTROVERT Division of Speedline Technologies has introduced the DLS Selective Laser Soldering System, developed in conjunction with Lockheed Martin. DLS-for "Diode Laser Selective"-system is designed to solder challenging electrical assemblies, such as temperature-sensitive components, products with large heat sinks, heavy backplanes or difficult angles and small pitch components, which often require hand soldering.
Using a patent-pending, full-function diode laser, the DLS delivers consistent, repeatable, quality solder joints at speeds up to 3 cm/second, according to the company. The DLS system workspace is about 15.5 inches long x 14.5 inches wide and is available with optional fiducial alignment for board accuracy. [speedlinetechnologies.com] Dow Corning Releases Si Coatings Dow Corning has released the Dow Corning 1900 Series, a family of three silicon-based conformal coatings formulated for superior performance, PC board protection, cost-of-use advantages and compliance with most international regulatory standards. In contrast to organic materials, such as acrylic and urethan, which cure to a rigid protective coating, Dow's silicon-based formulations offer flexible, low-stress protetion for fine-pitch leads and delicate components, thereby improving the reliability of ICs and PWBs. The new coatings are self-priming materials that use non-corrosive moisture/condensation cures. The coatings can be cured at room temperature or accelerated by heat, forming transparent elastomers with excellent electrical properties over a wide temperature range (-55\°C-200\°C). [dowcorning.com/electronics] Packaging Cost Analysis Software Available APT Interactive, Bangalore, India, has launched Packaging Cost Analysis Software, which can analyze and compare the cost of packaging technologies as a function of numerous variables, including wafer diameter, bond-pad size, die yield, assembly process yield and inhouse assembly vs. subcontractors. The software also permits the user to leverage the cost of ownership data files to string together process sequences to answer key questions like, "What is the cost of ownership?" and "What is the cost of packaging?" [aptinteractive.com] |
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