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 Publisher's Letter
Post-APEX Thoughts

 Opto-Electronically Speaking
The Once & Future Powers in Opto Packaging Comprise a Growing List

 Assembly Lines
Can Your Company Pass the 'Ethical Stink Test'? - and Other March Musings

 A View From Asia
Charting the IC Packaging Business? Follow that Wafer Foundry!

 Harvey Miller's Notebook
Intel's Vision of the Ultimate Package? Why It's the BBUL - No Package at All!

 On Test
Sharpen Your Recovery Test Strategies

 Industry News
Company News
People in the News
APEX 2002 Photo Album
Packaging Foundries
Opto/Nanotechnology
Calendar of Events
Editorial Index

 Features
Cover Story: IC Test Sockets Face New, Tough Demands for Finer Pitches and Higher Performance
International Directory of Socket Vendors

Cover Story: Optoelectronic Package Testing - Another Futile Exercise in Rube Goldberg Physics?

Final Test Trends: While Equipment and Processes Keep Evolving, the Outcome is Still Driven by the Bottom Line

Packaging's 10 Biggest Productivity Killers

Large Mobile Telecom Markets Are Helping Drive a European IC Packaging Revolution

 Tools & Technologies
SpeedTip Probe Card for RF Test and more...

 Patents
Oki Wafer-Level CSP Employs Existing Perimeter-Pad Chips

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
March - April 2002
APEX 2002 Photo Album

5,200 Visitors Gathered for This Year's APEX

San Diego-Despite a slow economy, IPC's SMEMA Council says more than 5,200 visitors gathered for the third annual APEX. Combined with exhibitors, the number reached 11,000 total visitors. "In light of our industry's current state, APEX 2002 was a very successful show," according to Denny McGuirk, IPC president. APEX 2003, scheduled for March 31-April 2, moves to Anaheim, Calif.

Adrian Wilson, president of Phoenix X-Ray Systems and Services
Nordson Asymtek Inc. of nearby Carlsbad, Calif., demonstrated and exhibited its extensive line of dispensing equipment.
Indium Corp. of America, Utica, N.Y., selected APEX 2002 to introduce a new line of lead-free materials, developed jointly with Motorola.
Universal Instruments of Binghamton, N.Y., displayed a host of newly developed products, including the GSM Platform for traceability at the board and component levels.
Dr. Tom Di Stefano, left, interviews Gene Munie about "green" electronics, during APEX. For more on the topic, visit microelectronicsforum.com
Dr. Evstatin Krastev (left) of X-Tek demonstrates x-ray inspection of BGAs for Kelly Mobley of Alcon Labs.
Photos by and © 2002 Chip Scale Review. All rights reserved.
 
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