Current Issue The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging March - April 2002 Email the editor

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.

April 3-4 Canadian High Technology Show International Centre, Mississauga, Toronto, Canada REC [reedexpo.ca.hightech] 9-12 NEPCON Microelectronics Shanghai Everbright Convention and Exhibition Centre Reed Exposition Companies [nepconchina.com] 16-18 SEMICON Europa 2002 New Munich Trade Fair Centre, Germany SEMI [semi.org] 17-19 2002 International Conference on Electronics Packaging (ICEP) and 16th Microelectronics Show Tokyo, Japan IMAPS [imaps.org] 29-30 Advanced Technology Workshop on Ceramic Applications for Microwave and Photonic Packaging Westin Providence Hotel, Rhode Island IMAPS [imaps.org] 30-2 Advanced Semiconductor Manufacturing Conference & Workshop Boston SEMI [semi.org]

May 7-9 SEMICON Singapore 2002 Suntec Singapore International Convention Centre SEMI [semi.org/semiconsingapore] 15-16 Telecom Hardware Solutions Conference & Exhibition Plano, Texas IMAPS [imaps.org] SMTA [smta.org] 19-24 CLEO/QELS 2002 Long Beach, Calif. Convention Center OSA [osa.org] 19-24 28-31 ECTC 2002 The 52nd Electronic Components and Technology Conference The conference will feature 10 half-day and two full-day short courses, taught by world-class industry experts. All courses are eligible for Continuing Education Unit credits. Sheraton San Diego Hotel & Marina CPMT, ECA, EIA, IEEE [ectc.net]