| Notes: This matrix is composed of information supplied by the respective socket manufacturers. Due to space limitations, this list is not all-inclusive as to manufacturers and products. For more information, visit the manufacturers’ websites or the Chip Scale Review website at ChipScaleReview.com. Issue advertisers are listed in boldface type. |
Company Name
Address
Year Founded |
Model
Introduced I/O Range
Operating Temperature
(Degrees Celsius) |
Contact Pitch (mm)
Technology
Inductance (nH)
Typical Insertions |
Applications
Packages Accomodated
Handlers Accomodated |
[website]
Contact e-mail
Phone Fax
Additional Offices - Notes |
3M Electronic
Handling & Protection
6801 River Place Blvd.
Austin, TX 78726
Founded:1980
|
Textool 0.65 mm Open Top
July 2001 Up to 625
-55° to 150° |
0.65
Patented dual beam
20K |
Burn-in, test
BGA, CSP
N/A |
[3m.com/ehpd/sockets]
Tony Smith,
Sales & Marketing Manager
alsmith@3m.com
b 512.984.6953 |
Textool 1.0 mm Open Top Type II-Q3
2002 Up to 1521
-55° to 150° |
1.0
Patented dual beam
20K |
Burn-in, test
BGA, CSP
N/A |
MicroTouch Area Array
2001-2002 Up to 800
-55° to 165° |
0.5 and up Proprietary contacts with particle-based conductive elastomer
<0.4, >10 GHz |
High performance test, hand-test characterization
BGA, CSP, LGA, MLF, QFN N/A |
Advanced Interconnections Corp.
5 Energy Way
West Warwick, RI 02893
Founded: 1982
|
True BGA Socket
March 1998
Any
-10° to 85° |
1.0, 1.27
Spring probes
(self) 1.46 avg. @ 100 MHz; (loop) 1.69 avg. @ 100 MHz |
Prototype, test
BGA, LGA
Tray Pack |
[fliptop2.bgasockets.com]
Curt Wilmot,
Application Engineer
cwilmot@advintcorp.com
Phone: 800.424.9850 Fax:401.823.8723 |
Aehr Test Systems
400 Kato Terrace
Fremont, CA 94539
Founded: 1977
|
DiePak Carriers
June 1995
Up to 320 (standard); 700+ (custom)
-55° to 150° |
0.75 Metal bump with compliance in carrier design <2
>1K in socket bare die up to 19.4 mm x 19.4 mm within standard carriers |
Burn-in and test for silicon ICs and GaAs photo devices
Die contact, flip chip and wire bond
All |
[aehr.com]
Martin Hemmerling,
Fixtures Sales & Service
mhemmerling@aehr.com
Phone: 510.623.9400 Fax: 510.623.9450 |
AQL Manufacturing Co.
9755 SW Commerce Circle
Wilsonville, OR 97070
Founded: Not Supplied
|
B Series–Shielded
Fall 2000 >2000
-50° to 150° |
1 and 1.27
Patent pending spring probe
0.37 100K |
Prototype and test
BGA, CSP, MLF, QFP, etc.
All |
[aqlmfg.com]
Doug Kocher
doug@aqlmfg.com
Phone: 503.682.3193
Fax: 503.682.1648 |
B Series
2001 16-2000
-50° to 150° |
0.5-1.27
Compliant probe
1 100K+ |
Prototype and test
BGA, µBGA, MLF
All |
LI Series
2001 16-2500
-50° to 150° |
1-1.27
Custom spring probe
0.3 150K+ |
Prototype and test
BGA, µBGA, MLF
All |
Aries Electronics
62A Trenton Ave.
Frenchtown, NJ 08825
Founded: 1972
|
High Frequency Spring Probe Test Socket Nov. 2001
Up to 1100 -55° to 150° |
0.5, 0.65, 0.75, 0.8
Spring probes
0.5 @ 0.5 mm pitch >500K |
Test, burn-in, prototype
BGA, CSP, LGA, MLF, µBGA
Configurable for all handlers |
[arieselec.com]
Frank Folmsbee,
Sales Manager
frankf@arieselec.com
Phone: 908.996.6841 |
RF Interposer Socket
TBA Up to 1200
-40° to 125° |
<0.3
Etched Kapton
0.2 300K |
Test, prototype
BGA, LGA, MLF, QFP, µBGA, others
All |
CSP/BallNest Hybrid ZIF Socket
May 2001 Up to 2000
-55° to 150° |
0.5 to 1.27
Spring probes
10 (to be tested) Up to 10K |
Burn-in, prototype, test
BGA, CSP, LGA
N/A |
Azimuth Electronics Inc.
2605 S. El Camino Real
San Clemente, CA 92672
Founded: 1964
|
5250-100W-7S/R
March 2001 7-14
-55° to 150° (240° option) |
1
Cantilever/wiping action 50K |
Burn-in, prototype, test
BGA, CSP, MLF, etc.
Laser diode, flatpacks and
butterfly packages with wider leads up to 0.39 wide |
[azimuth-electronics.com]
RoJean Hall, Sales & Marketing
sales@azimuth-electronics.com
Phone: 949.492.6481
Fax: 949.492.0744 |
5253-100W-7S/R
March 2001 7-14
-55° to 150° (240° option) |
1
Cantilever/wiping action 50K |
DCI, Division of Credence Systems
3350 Scott Blvd., Bldg. 58
Santa Clara, CA 95054
Founded: 1989 (Formerly Liberty Research Labs)
|
Liberty Pogo Socket
1997 1681 positions
-50° to 150° |
0.3 to 1.27
Spring probes
0.7 to 1.2 >500K |
OC-198 telecom, <50ps Tr characterization and production BGA, CSP, QFN, QFP, strip, etc. Most handlers |
[dci-us.com]
Nick Langston Sr., Product Line Mgr.
nicksr@dci-us.com
Phone: 408.988.6800
Fax: 408.988.8950 |
Elastomer Sockets
1996 1225 positions
-35° to 105° |
0.5 to 1.27
Elastomer
0.3 to 0.4 1K |
Prototype, high BW, low cost
BGA, CSP, QFP
Not suitable |
Kapton-PI Sockets
Jan. 2002 484 positions
-50° to 150° |
0.5 to 1.27
Kapton
0.2 >500K |
High BW, low TR
MLF, QFN, QFP
Most handlers |
Emulation Technology Inc.
27 St. Cuthberts St.
Bedford MK403JG
United Kingdom
Founded: 1983
|
Silver Wings Socket System
April 2001
48-2500
-20° to 100° |
0.50, 0.75, 0.80, 1, 1.27, 2.54
Elastomer
>5K/contact pad |
Debug, development, emulation, hand test, programming, qual, test
BGA, µBGA
Not adapted to handlers |
[emulation.com]
Joseph Bagliere, President
joe@emulation.com
Phone: 408.982.0660
Fax: 408.982.0664 |
Enplas Tesco Inc.
765 N. Mary Ave.
Sunnyvale, CA 94085
Founded: 1997 (Formerly Enplas
Tech Inc./Tesco International)
|
OTB-484, OTB-784-0.5-01/BGA-484, BGA-784-0.5-01
October 2001
484/784
-55° to 150° |
0.5
Spring module
10
5K |
Burn-in and test
CSP 0.5 mm
N/A |
[enplas.com]
Michelle Windle
mwindle@enplas.com
Phone: 408.749.8124
Fax: 408.749.8125 |
E-Tec Interconnect Inc.
Industrial Zone C, CH-1072
Forel (Lavaux), Switzerland
Phone: +41.21.781.08.10
Fax: +41.21.781.08.11
Founded: 1992
|
BxW/LxW (screw lock)
BxK/LxK (knob lock)
BxP/LxP (solderless compression)
1995 (first 1.27 mm pitch models)
>2000
-55° to 130° |
0.75, 0.80, 1, 1.27, 1.5
Spring probes
<5
1K |
Pre-production and prototype
BGA, CSP, LGA
Not adapted to handlers |
[e-tec.ch]
Chris Hafter info@e-tec.ch
USA: Bud Kundich
mailbox@kundich.com
Phone: 408.746.2800
Fax: 408.746.0969 |
