Shellcase Certified to ISO Standard, Plans Facility Expansion Jerusalem-Shellcase says that is has received ISO 9001:2000 certification for its quality system from Bureau Veritas Quality International. The company says it will also expand its Jerusalem facility with 15,0002 feet of additional cleanroom production space for packaging silicon wafers at the wafer level. [shellcase.com] PSi Technologies Signs Contract to Supply Power Integrations Manila-Psi Technologies has signed a supply agreement with Power Integrations Inc., San Jose, a developer and maker of high-voltage ICs for AC-to-DC power conversion. The agreement calls for PSi Technologies to provide Power Integrations with outsourced assembly services, primarily for the San Jose company's TO-220 integrated offline switcher (Topswitch) IC family. [psitechnologies.com] Fabless Group Presents Awards to Hackworth, NVIDIA Corp. San Jose-The Fabless Semiconductor Association (FSA) named Michael L. Hackworth, chairman of Cirrus Logic Corp., winner of its 2001 Dr. Morris Chang Exemplary Leadership Award. Other winners included Atheros Communications for "Most Respected Private Fabless company," and NVIDIA Corp. for "Most Respected Public Fabless Company" and "Best Financially Managed Company." [fsa.org] 
Carsem Adds 8-Lead Option to 1 mm-Thick TSOT Package
City of Industry, Calif.-Carsem says it has added an 8-lead option to the 5- and 6- lead options for TSOT packages. The TSOT family meets JEDEC reference MO-193, offers the same footprint as the SOT23, but is only 1 mm thick, compared to the SOT's thickness of 1.45 mm. In addition to being thinner, the TSOT improves thermal performance by 10 percent, according to the company. [carsem.com] 
Amkor Offering Saw-Singulated JEDEC M0220/229 Packages Chandler, Ariz.-Amkor Technology Inc. is offering saw-singulated QFN (quad flat no-lead) packages from its facilities in the Philippines. The packages conform to JEDEC M0220/229 specs, and range in size from 2 x 2 mm to 10 x 10 mm, to handle die from 0.25 mm2 to 10.2 mm2. The QFN can be manufactured with four different lead finishes, including NiPd, SnPb, SnBi and matte Sn. The company says initial high-volume production is based on a redesigned Amkor MicroLeadFrame matrix, dedicated to saw singulation of devices, which enables higher device density of the lead-frame strip. Amkor notes that the QFN format has gained wide acceptance in wireless communications products, hand-held computing devices and hand-held instruments. [amkor.com]
Amkor Transfers Flex-on-Cap To Its Gwangju, Korea Facility Gwangju, Korea-Amkor says it has successfully transferred Kulicke & Soffa Industries' Flex-on-Cap and redistribution technologies to its plant here. The Amkor plant offers a monthly capacity of 10K 200 mm wafers. Amkor says it completed a 35-step certification audit and conformed to yield expectations set by K&S' Flip Chip Division, Phoenix, Ariz. [kns.com] 
ASE Group Develops 300 mm Wafer Solder Bumping Technology Santa Clara, Calif.-Advanced Semi-conductor Engineering, headquartered in Taiwan, says it has completed the development of its 300 mm wafer solder bumping technology. The company has installed a fully automated solder bumping line for 300 mm wafers, and customers are conducting qual tests on reliability and quality during this quarter. After these tests, the new line will be able to handle a monthly capacity of 5K 300 mm wafers. [aseglobal.com] ASE Partners for "Bluetooth" Package Taipei-ASE says it has partnered with Cambridge Silicon Radio, Cambridge, U.K., to build CSR's next-generation Bluetooth chip with a single-chip implementation baseband and controller. The ASE facility in Chung Li, Taiwan, is providing turnkey packaging and test for CSR. ASE claims its fine-pitch bonding enables smaller solder balls and a fine pitch than conventional BGA methods. The result, according to ASE, has given the Cambridge company the industry's lowest form factor for Bluetooth baseband, RF, microcontroller and memory units. Additionally, ASE's VFBGA provides more I/O without increasing the size of the chip, leading to "substantially increased product stability and performance." 
STATS Garners ADI's Top Supplier Award Norwood, Mass.-Analog Devices Inc. has named ST Assembly Test Services Ltd. (STATS) its "Assembly and Test Supplier of the Year for 2001." The ADI Supplier Awards are based on a rating program that review performance metrics such as cycle time, on-time delivery, yield, quality and customer service. [stts.com] |
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