 | | The GaN-on-diamond wafer addresses the classic heat problem plaguing high-power and high-speed devices. |
Group4 Labs Develops GaN Wafer Substrate
Menlo Park, Calif.—Group4 Labs has developed a gallium nitride-on-diamond semiconductor wafer, known as the Xero Wafer.
Group4 says the wafer sits less than 0.5nm away from a synthetic diamond substrate and features unprecedented high-temperature resilience for high-power, high-frequency military and photonics applications.
The wafer is initially available in 10mm x 10mm squares, and is claimed to be ideal for use in the conventional epitaxial growth of GaN and its Al and In-based alloys.
The wafer is shipped freestanding or optionally on a disposable Si wafer mount to permit easy handling during wafer processing. [group4labs.com]
Defect Inspection Vision System
Hauppauge, N.Y.—RVSI Inspec-tion recently introduced the first production version of a new Pack-age Visual Inspection (PVI) platform incorporating AVS vision technology, which enhances the company’s LS product series. The new platform operates as much as 4x the speed of the previous generation. [rvsi.com]
 | | The Pernicka Model 700G is a closed system that accumulates and analyzes all gases in the system. |
Pernicka Intros Medical Hermeticity Test System
Fort Collins, Colo.—Pernicka Corp. has introduced the Pernicka Model 700G, a Cumu-lative Helium Leak Detection (CHLD) test system. The unit is aimed at the stringent reliability needs of the medical, space and other high-reliability applications.
The system will test any type of hermetic package to ensure absolute integrity, according to Pernicka. A key feature is its ability to detect any type of leakage. The CHLD process replaces the old, two-step fine-leak and gross-leak tests with a single-step process.
In the Model 700G, the package to be tested is first subjected to very high pressure helium gas, using a He bomb and the same process used for traditional leak detection. The package is then placed in the 700G’s test chamber, and the pressure is reduced with a cryopump designed for this application.
The cryopump freezes Ni, O2 and other heavier gases, leaving any trace helium in the gaseous state. The test chamber is evacuated through a mass spectrometer, which analyzes all material removed from the chamber, including the test gas. The system fully implements Mil-Std 750 Method 1071, Procedure CH1-Ch2. [pernicka.com]
 | | Bergquist’s Gap Filler 3500S35 is formulated for applications that require thermal transfer of multi-height components to a universal heatsink. |
Berquist Debuts Gap Filler For ‘S-Class’ Product Line
Chanhassen, Minn.—Berg-quist has introduced Gap Filler 3500S35, with thermal conductivity of 3.6 W/M-K and softness of Shore (00)-32. The filler is electrically isolating and is the latest addition to Bergquist’s growing line of ultra-soft “S-Class” gap fillers.
A key feature of the product, according to Bergquist, is its “superior ability” to “wet-out” the interface surface. This characteristic reduces air voids at the application surface which increases surface area contact and lowers interfacial resistance. [bergquist.com]
 | | The FocalSpot inspection system offers a magnification of >650x. |
FocalSpot Announces X-ray Inspection Unit
San Diego, Calif.—FocalSpot Inc. has introduced the newly redesigned Concept FX multi-axis x-ray inspection system.
The unit is available with 80/ 90/130 kV x-ray source options, six axes of motion control, operator-friendly ergonomic design and a no-clamp sample tray for fast load/unload
The system’s x-ray source and detector tilt off-axis in relation to the sample to provide oblique object viewing in realtime. The FX offers a small footprint of 1150mm D x 1300mm W, but is capable of inspecting large PWBs up to 500mm x 600mm, representing 60 percent larger board handling than similar-sized units.
Applications include failure analysis of bare boards, assemblies and parts; component interlayer prototyping, manufacturing process validation and rework verification. [focalspot.com] |
