MicroTek Offers Process Pallets

Palm Beach, FL - MicroTek Industries recently announced a line of process pallets for use in package assembly.

The pallets are used to automate the production of BGA, MCM-L, CSP and TBGA packages, where the pallet becomes the product line's common interface element.

The MicroTek pallets can provide the interface for laminate component assembly, tack lamination, ball attach, reflow, cleaning and inspection.

A dimensionally stable, proprietary alloy is employed in the MicroTek pallets. The alloy remains unaffected by the typical convection oven thermal cycling encountered during adhesive curing and solder reflow.

Process pallets are available with a wide range of protective coatings and colors.

MicroTek Industries Inc., 2350 Commerce Park Dr., NE, Suite 1, Palm Bay, FL 32905, 407.728.7852, fax 407 728.7189, www. microtek-ind. com