Publisher's Letter eMail the Editor

Features Is Your Chip-Scale Package Really "Testable"? Before you answer what may appear to be an obvious question, you'd better read this! By Jack kessler, Guest Editor High-Performance Socket Requirements for Chip-Scale Packages Increasingly complex package assembly and test tooling, the market entry of the Rambus memory interface and the finer pitches demanded by today's CSPs are creating new challenges for suppliers of IC test and burn-in sockets. Dr. Rao Mahidhara, Technical Editor Technical Forum Spring Contact Probe Simplifies IC Device Testing The spring contact probe—a technology originally designed for PC board testing--provides extremely linear and reliable contact force and electrical performance, even when used in temperature extremes from -50°C to 150°C. Tim Dowdle and Kevin Koontz, Synergetix, Kansas City, Kansas