World's Fastest Lead Bonder Announced

The Model 8020 µTAB lead bonder was developed from the 8020 gold ball bonder platform for chip-scale packages and is claimed to be the fastest bonder of its kind.

Kulicke & Soffa Industries has introduced the 8020 µTAB lead bonder, offering bonding speeds in excess of 15 leads/second, claimed to be the fastest of its type. The bonder was developed for single-point bonding of CSPs, including Tessera's µBGA® package and represents a substantial upgrading of the company's Model 8020 gold ball bonder, according to the company.

The Model 8020 bonds leads directly to bond pads, one lead at a time, in an "S" shape. This shape enables the package to compensate for thermal variations between the die and the PC board for greater reliability. Bond placement repeatability is +-5 mm@3 sigma.

Platform features include open software architecture and multiple material handling options for factory integration flexiblity. K&S can upgrade existing Model 8020 gold ball bonders in the field to handle CSPs.

Kulicke & Soffa Industries, 2101 Blair Mill Rd., Willow Grove, PA 19090, 215.784.6000, fax 215.659.7588.