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Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.
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April
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18-20
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HD International
Santa Clara (Calif.) Convention Center
Exhibits: April 18, 11 a.m.-6:30 p.m.; April 19, 11 a.m.-4:30 p.m.
Conference: April 17-20
HD International opens its second annual conference and exhibition in its new Silicon Valley venue.
An opening night reception will take place on the exhibit floor Wednesday, April 18, 5:30 p.m.
IMAPS [imaps.org],
CMP Media [hd-international.com]
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18-20
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International Conference on Electronics Packaging (ICEP) and 15th Microelectronics Show
Tokyo Ryutsu Center
IMAPS Japan [jiep.or.jp],
JIEP, IEEE CPMT Japan Chapter [imaps-j@jiep.or.jp]
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24-26 |
SEMICON Europa
New Munich (Germany) Trade Fair Centre
Exhibits: April 24 and 25, 10 a.m.-5 p.m.; April 26, 10 a.m.-4 p.m.
SEMI [semi.org]
Kerstin Stuckey, kstuckey@semi.org
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24-26 |
SMT/ES & S/
Hybrid 2001
Exhibition Center Nuremberg, Germany
System Integration in Microelectronics
Hours: 9 a.m.-5 p.m.
Mesago Messe & Kongress GmbH [smt-exhibition.com]
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May
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8-10
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SEMICON Singapore 2001
Singapore International Convention and Exhibition Centre
Singapore and the Southeast Asia region are projected to purchase nearly $2 billion in semiconductor equipment. This show, according to SEMI, has grown an average of 25% yearly since 1991 and draws more than 7,500 visitors from 25 countries.
SEMI [semi.org]
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29-June 1 |
The 51st Electronic Components and Technology Conference (ECTC)
Wyndham Palace Resort and Spa, Lake Buena Vista (Orlando), Fla.
This year's ECTC will feature more than 250 technical papers in 38 sessions, covering the latest innovations in electronics. Areas covered will include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, quality and reliability, manufacturing technology, components and RF, connectors and contacts.
IEEE [ieee.org], CPMT, EIA/ECA
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June
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18-19
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Flip Chip 2001 Conference & Exhibition
Four Seasons Hotel, Austin, Texas
With the predicted growth of the flip chip industry, IMAPS decided that a larger venue was needed for this year's program, resulting in a move from the former venue in Braselton, Ga.The technical program will continue to focus on recent advances in flip-chip technology and ways to implement them.
A focused exhibition will feature suppliers who support the industry.
IMAPS [imaps.org],
Peter Elenius, General Chair
[pelenius@flipchip.com]
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