April 2003 The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging Email the editor

Electroglas Inc. says it has received a multi-system order for the QuickSilver IIe wafer inspection system.

Electroglas Wins Multi-System MEMS Inspection Tool Order

San Jose-Electroglas Inc., a supplier of process management tools for the semiconductor industry, has won an order for multiple QuickSilver IIe wafer inspection systems from an undisclosed supplier of desktop printers and printer accessories.

The systems will be employed in facilities around the world for QA and process control during the production of printer heads, a fluidic MEMS device. The high-performance, machine-vision system identifies, measures and classifies defects on processed wafers at production rates. [electroglas.com]

EV Group 560 production wafer bonder

EV Group Ships MEMS Gear to Asia Pacific Microsystems

Schärding, Austria-EV Group, a manufacturer of MEMS and wafer processing equipment, has concluded a multi-million-dollar equipment purchase agreement with Asia Pacific Microsystems Inc., Taipei, Taiwan.

APM designs and builds MEMS sensors and wireless communications devices. This order completes a production line for APM's MEMS wafer foundry.

The order includes a precision alignment and lithography system, automated resist processing systems, a single wafer and mask cleaner and an EVG560 production wafer bonder for performing the most critical steps in microfabrication.

APM employs double-sided alignment and wafer bonding (anodic, fusion, eutectic) throughout the whole MEMS manufacturing processes. [evgroup.com]