PSi Technologies Reports Improved Revenues for '02 Year-over-Year; Profitability Expected in Q3 Manila-PSi Technologies Inc. reported revenue of $18.7 million for Q4 2002, an increase of 44 percent on a year-over-year basis. For the quarter, however, revenues fell 3.6 percent over the prior quarter last year. Earnings per share for Q4 were marginally less at $ (0.12) compared to the comparable quarter of 2001, which posted a per-share loss of $ (0.13). The company projected a sequential revenue growth of 5-10 percent for Q3 this year, with profitability expected by the second half. Revenues from the company's top 5 customers totaled $15.2 million for the quarter, a 2.8 percent decline compared to the prior quarter, but a 56 percent increase compared to Q4 2001. For 2002, PSi Technologies reported revenues of $70.3 million, an increase of 31.4 percent over the prior year's revenues of $53.5 million. Net loss for the year ended December 31 totaled $6.5 million or $0.49 per diluted share, compared to a net loss of $5.5 million or $0.41 per diluted share for 2001. "Despite seasonality in the business, the company built and sold more product in the fourth quarter of 2002 than in other similar periods in the company's history," according to Chairman Arthur J. Young Jr. By geography, U.S.-based customers accounted for half of sales, while European customers comprised 38 percent. Asia accounted for the rest. The company's largest customers (alphabetically) were Infineon, ON Semi-conductor, Philips and STMicroelec-tronics. [psitechnologies.com] Morris Joins Carsem Inc. as Sales Account Manager City of Industry, Calif.-Industry veteran Hollis Morris has joined Carsem Inc. He has assumed the post of sales account manager and is based in Southern California. Morris reports to John King, western regional sales manager. Prior to joining Carsem recently, Morris served with AIT in the company's Austin, Texas, office. His earlier affiliations include ASAT and Amkor Technologies Inc. [carsem.com]
STATS Qualifies FOL Package Assembly for 300mm Wafers Singapore-STATS has qualified its front-of-line (FOL) assembly operations to handle ICs in 300mm wafers. The company says its automated FOL in-line module is aimed at eliminating handling risks common to the larger wafers. The process involves automated wafer taping prior to backgrinding. During backgrinding, wafer thickness is measured automatically by the integrated in-line module. After backgrinding, wafers are automatically mounted onto metal rings, detaped and sent to wafer saw. STATS in-line module can thin 300mm wafers down to 100µm for stakced die and SiP applications. [stats.st.com.sg] Carsem Expands MCM, SiP and SSBGA Format Capacity Ipoh, Malaysia-Carsem is expanding its multichip module (MCM), small-scale BGA (SSBGA) and System-in-Pack-age (SiP) assembly and test capacity to support an expected three-fold increase in demand this year.
The company says it has been working with several key customers on multiple turnkey SiP and MCM development programs. "During the last few quarters, we have seen a significant growth in volumes, using both our wire bond and flip-chip technology," according to Paul Smith, marketing director. "Carsem's ability to design, manufacture and test the more complicated SiP has demonstrated our strengths in the array package, and, as a result, we are seeing our customers increase their single-die SSBGA volumes, as well, Smith said. Smith added that many customers have elected to employ SiP or MCM approach to develop new products, rather than the more expensive and time consuming system-on-a-chip. [carsem.com] Ong Named Ellipsiz Div. President Singapore-Ong Puay Han has been promoted to president of Elipsiz Group's Engineering Solutions Div., after serving in that post for the past year. [ellipsiz.com] |
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