Optical Alignment Tool for Assembly Palomar Technologies of Vista, Calif., has introduced the FAST 6, a six-axis optical alignment system for test and production assembly. The system is modular to provide maximum flexibility. The company says the unit is suited for AWGs, VOAs, laser diodes, discrete optics, fiber arrays, transmitters, planar waveguides, receivers, splitters and modulators. [palomartechnologies.com] Underfill Valve Aimed at Stacked Die Packages Asymtek of Carlsbad, Calif., is now offering the DispenseJet DJ-2100 Series valve for underfill. Jetting underfill is said to be useful for dispensing in tight areas where standard needle dispensing is impossible, such as dense PC boards or stacked die packages. Jetting is faster than standard, needle-dispensed techniques and produces extremely small fillets, making it possible to produce boards and packages with smaller dimensions. [asymtek.com]
266nm Diode-Pumped Laser Boasts High Power Coherent Inc. of Santa Clara, Calif., has released the AVIA 266-3000 unit, which it claims is the "the industry's highest power and longest lifetime, Q-switched, diode-pumped 266nm laser." The unit is the latest addition to Coherent's AVIA product line and offers a fourth harmonic crystal lifetime claimed to be 6x longer than earlier 266nm lasers. The laser is targeted for applications in micromachining and microelectronics. [coherent.com]
Automated System for Aligned Wafer Bonding EV Group of Schärding, Austria, recently demonstrated the 300mm-capable IQ Aligner. The unit is available as either a manual or fully automated system for lithography and aligned wafer bonding in advanced IC packaging and MEMS applications. The IQ Aligner features top side, bottom side, large gap and darkfield alignment capabilities. Attributes for wafer-level packaging include aligned exposure of very thick resist layers and full-field proximity exposure for wafer bumping. [evgroup.at] Cleaner Designed to Deflux Bumped Wafers Kyzen Corp. of Nashville, Tenn., has announced MX2101, an engineered aqueous cleaning solution for precision defluxing. The solution is designed for high-temperature, high-lead and no-lead reflowed residues, as well as for uncured adhesives, while maintaining compatibility with BCB coatings. Available in 1, 5 and 55-gallon drums, the formula is for use with both batch centrifugal and spray equipment at concentrations from 5 to 15 percent. All ingredients used in the solvent are TSCA listed, and the product is not classified as a flammable liquid by DOT/NFPA. [kyzen.com]
BGA Socket, Probing System for Debugging Emulation Technology of Santa Clara, Calif., has introduced the Ball Grid Array Socket and Probing System, which ensures complete signal access between target PC board and IC package during in-circuit test and debug. System applications include prototyping socket, chip screening using a known-good board, emulator adapter or logic analyzer/scope adapter. The company says the system is also useful for package conversion or cost reduction. The company also recently announced ChipFix, a new line of custom adapters. According to ET, designers formerly were forced to scrape and/or revise motherboards to accept new IC designs. ChipFix, however, permits the use of existing system boards through the creation of either a simple daughter board or a module conversion. [emulation.com] Via-Filling Process Eliminates Voids DEK International GmbH of Zurich has developed the Via Fill process, which the company claims delivers 100% substrate via filling without voids and with minimal surface residue. The process employs DEK's ProFlow DirEKt Imaging system to achieve results with aspect ratios of up to 8:1. DEK claims the process is "highly repeatable" and speeds throughput by more than 5x over conventional squeegee-based fill processes. In operation, the fully enclosed ProFlow head is used in conjunction with a sheet of blotting paper under the substrate and on top of the tooling block. Vias are filled in two print passes, with a paste pressure of 2.5 bar and a print speed of 25mm/s. [dek.com] BGA Sockets for High Performance Dimensions Consulting Inc. of Santa Clara, Calif., has announced a new line of BGA sockets for high-performance applications, including backplane electronics and optical communications. Known as the DCI QuickTurn family, the sockets are said to be "the industry's first set of configurable sockets that can be delivered within a week." The socket line is based on JEDEC standard array formats for 1.27mm, 1.0mm and 0.8mm pitch with pin configurations up to 40x40mm available. The sockets are supported by all major test handlers. [dci-us.com]
X-Ray Inspection System Uses Digital Data Dage Precision Industries of Fremont, Calif., has released the XD Series of digital x-ray inspection systems. The series employs Dage's XiDAT integrated digital image acquisition technology for digital data processing, enhanced resolution with extensive grayscale definition. The XiDAT system acquires images with a resolution of 1300 x 1000 pixels and more than 65,000 grayscale levels. All processing is "Hyper-Thread" compatible, utilizing the latest Intel technology. [dageinc.com] Inline Plasma System Given Enhancements March Plasma Systems, a Nordson company, of Concord, Calif., has developed enhancements for its XTRAK inline plasma treatment systems that increase performance and throughput. Among them is the system's new SMART Tune management system, which provides closed-loop plasma control that cuts tuning time to under one second. [marchplasma.com] 3-Layer Micro-Vias, Reduce System Cost Teradyne's Connection Systems Division (TCS) of Nashua, N.H., is offering HDI panels up to 24 x 28cm with 3-layer deep, or 3 mil microvias. The company says the PC boards may allow circuit designers to reduce system costs, along with layer count, by up to 20 percent. [teradyne.com]
New Packages Offer Solid Core Al Vias Micro Components Ltd. of Migdal Ha'emeq, Israel, is offering the SuperPak advanced CSP-style package featuring solid core aluminum vias and exposed die-pad heatsink. The substrate is a hybrid of Al2O3 and polymer. Via resistance is below 1mW. Other package attributes include an integrated ground plane, low-loss dielectric and low inductance, which makes the package suitable for RF applications. The die can be interconnected with wire bonding or by flip chip. The package substrate, which is 200µm thick, is JEDEC Level 1, lead- and halogen-free and 300\° reflow-capable. The packages can be tooled for footprint compatibility with popular formats such as CSPs, QFN, SON and related types, enabling drop-in replacement. The company is represented in the U.S.A. by PackageTrends. [mcstek.com] GPD Global Selects Altus GPD Global of Junction, Colo., a manufacturer of dispensing equipment, has appointed the Altus Group Ltd. of Manchester, England, as its sales representative for the United Kingdom and Ireland.[gpd-global.com] [altusgroup.biz] |
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