April - May 2009
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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STATS ChipPAC Delivers Low-Cost Flip-Chip Technology [more]
Nemotek Technologie Has Certification of Class 10 Clean Room for Wafer-level Manufacturing [more]
IPC White Paper Examines The Myths And Facts of HDI Technology For North America [more]
North America Chip Sales Leading Indicator Down In March [more]
STMicroelectronics Defies Flat Car Infotainment Chip Market [more]
Chaos Reigns in Top 20 Semiconductor Company Ranking [more]
Touch Screen Module Revenues Forecast to Reach $9B by 2015 [more]
59th ECTC’s Focus on Optoelectronics and 3D Interconnect Technologies, May 26-29 [more]
IWLPC’s Wafer-Level, TSV, 3D IC Packaging and Test Call for Papers [more]
George G. Harman, Wire Bonding Innovator, to Receive 2009 IEEE CPMT Award [more]
Barnum Named General Manager of Sensata Technologies [more]
Henkel Appoints Jim Wise to Lead Global Sales for Electronics Assembly Business [more]