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Never Underestimate the Power of the Internet for Packaging Foundries
 
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Leadframe CSPs Provide an Expanding Solution to Cost Objections
 
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JEDEC's JC-11 Committee Standardizes Leadframe-Based CSPs
 
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Flip-Chip and/or CSP: Separating the Sheep from the Goats

 
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Money for Test R&D Is Tiny Compared to IC Fabrication Dollars
 
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Working with SECS to Automate CSP Processing
 
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Trade Show Wars: NEPCON West Fizzles, APEX 2000 Sizzles
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Smooth Sailing Ahead for Test and Burn-in Sockets
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Advantages of Surface-Mount CSP Burn-in Sockets
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

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 Company News

Everett Charles Technologies Acquires PrimeYield Systems

Pomona, Calif.-Test interface supplier Everett Charles Technologies (ECT), a subsidiary of Dover Corp., has acquired Minnesota-based PrimeYield Systems.

PrimeYield makes test contactors, as does ECT, and is the North American distributor for Micronics Japan Co. probe cards for semiconductor test.

With the acquisition, PrimeYield will become part of ECT's Semiconductor Test Group.

This is the second acquisition of a sockets maker in as many months. Liberty Research, Santa Clara, Calif., was acquired about one month earlier by DCI, also located in Santa Clara.

Van Loan
Godfrey

In the ECT announcement, CEO Dave Van Loan reported that "PrimeYield's business strategy and market forces are highly complementary to ECT's existing semiconductor test business . . . The PrimeYield acquisition is one of a series of steps we will make in this business. Mark Godfrey, CEO of PrimeYield, and the management team will remain in place."

Multi-Tiered Displays

The multi-tiered displays by Panasonic and Philips were back, albeit in a much smaller hall. Traffic though the main aisles was continuous, as was the constant din that circulated through the small Long Beach Convention Center.

APEX won the backing of such major industry organizations as the EIA, Electronics Representatives Association, IMAPS, MEPTEC and SEMI, while NEPCON's key association sponsors were the IEEE and the SMTA.

Is the IPC smarter than REC, probably the largest expo group in the world? Probably not, but luck, a compact exhibit hall with narrow aisles, doing some of the right things and-most importantly-backing from the industry's largest suppliers didn't hurt a bit.

[apex2000.org] [nepcon.com]

Sikama International Inc. Doubles Facility Size

Santa Barbara, Calif.-Sikama Inter-national Inc., a maker of solder reflow systems, has doubled the size of its manufacturing plant. The corporate offices, including sales, marketing and accounting have been relocated to an adjacent building.

The new facility features a demonstration showroom with many operational machines, including the Falcon 5/C, Falcon 1200, Falcon 8500, UP2000, Falcon 5 x 5 and the Digital Hotplate.

[sikama.com]

Tessera Plant on the Block

Singapore-Tessera is planning to sell its pilot and pre-production manufacturing facility here, the San Jose-based company recently announced.

The company said the plant has outlived its original purpose as a demonstration site for the company's µBGA chip-scale package. Tessera will now focus on its core intellectual property business, according to Dr. Bruce McWilliams, president and CEO.

[tessera.com]

Quad Systems Claims Victory in Zevatech Patent Dispute

Willow Grove, Pa.-Quad Systems says that it has won its patent dispute with Zevatech AG in the German Federal Supreme Court, over German patent DE 33 40 084, which relates to Quad's component alignment system (CAS).

The German court, according to Quad, also said it will further restrict the claims of one of Zevatech AG's European patents (EP 0144 717).

Zevatech, formerly owned by ESEC, but now owned by Juki Automation, had claimed that Quad's CAS infringed the Zevatech patents.

Quad's CAS is marketed under the trademark "QuadAlign" and is currently employed on Quad's "C" and Q" Series of IC placement systems, as well as on some Samsung Aerospace SMT chip mounters.

[quad-sys.com]

New Edition of Industry Packaging `Bible' Is Now Available

The third edition of the classic Electronic Packaging and Interconnection Handbook by Charles A. Harper has been published by McGraw-Hill, New York.

Harper is president of Technology Seminars Inc. and is the author of many McGraw-Hill handbooks. He is also series advisor to the publisher's electronic packaging and interconnection series.

This edition contains more than 60% new material with new or added coverage of single-chip packaging, BGAs, CSPs, direct chip attach and low-cost flip-chip technologies.

The book contains 1024 pages with 700 illustrations and is priced at $125. According to the publisher, this book is McGraw-Hill's "major title and the leading reference in the industry."

[mcgraw-hill.com]

Packaging Foundry CS2 Sells Stock on EASDAQ Exchange

Brussels-Packaging Foundry CS2 (Custom Silicon Configuration Services) Zaventem, Belgium, has offered some 4,704,545 newly issued shares and 750,000 existing shares of its stock on the EASDAQ (European Association of Securities Dealers Automation Quotation) exchange.

The shares, with their price range fixed between 11 and 14 euros (about $10.90-$13.88), were sold through public offerings in Belgium and by private placements in other selected European countries.

The proceeds, according to the company, will be used to increase its automated packaging lines from two to six. CS2 also plans to invest in a new facility in Kortenberg, Belgium, and in the development of a series of thin film technologies.

CS2 has licensed the technologies from IMEC, the largest independent R&D center for microelectronics in Europe.

Lerner

Trading in CS2 (CSCS) began on March 3. The company employs over 160 people from over 20 countries. Its founder and CEO, Steve Lerner, is an industry veteran with prior posts at Amkor and Swire Technologies.

Lead underwriters for the offering were Paribas and Fortis.

[cs2.be]  [easdaq.be]

Pb-free.com Delivers Lead-free Information

Utica, N.Y.-The Indium Corp. of America has opened pb-free.com, a Web site devoted to lead-free soldering, available materials and pending legislation.

The site offers an extensive FAQ section and an extended list of informative links to industry groups and lead-free resources, according to the company.

[indium.com]

ASAT Earns Vitesse's Vendor of the Year Award

Camarillo, Calif.-Vitesse Semicon-ductor Corp. has presented packaging foundry ASAT, Fremont, Calif., with its 1999 vendor of the year award.

Vitesse's vendor of the year selection is based on product quality, on-time delivery, customer service, cycle time and pricing.

[asat.com]  [vitesse.com]

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