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 Publisher's Letter
A Very Happy First Birthday to Us!
 
 Assembly Lines
Never Underestimate the Power of the Internet for Packaging Foundries
 
 Electronic Trends
Leadframe CSPs Provide an Expanding Solution to Cost Objections
 
 Standards
JEDEC's JC-11 Committee Standardizes Leadframe-Based CSPs
 
 Wafer - Level Watch

Flip-Chip and/or CSP: Separating the Sheep from the Goats

 
 On Test
Money for Test R&D Is Tiny Compared to IC Fabrication Dollars
 
 CSP Automation
Working with SECS to Automate CSP Processing
 
 Industry News
Trade Show Wars: NEPCON West Fizzles, APEX 2000 Sizzles
People in the News
Company News
Calendar of Events
 
 Features
Smooth Sailing Ahead for Test and Burn-in Sockets
Socket Manufacturers and Specifications
Meet the New Kid on the Flip-Chip Lithography Block
Assembly Considerations for micro SMD Wafer-Level CSPs
An Expert Looks at the Issues™
 
 Technical Forum
Advantages of Surface-Mount CSP Burn-in Sockets
Silicone Packaging Materials with Low Alpha Particle Emissions Prevent `Soft Errors'
 
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ERSA Offers New Inspection System and more
 
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 Patents
Stackable 3-D Chip-Scale Package Uses Silicon as the Substrate
 
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An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

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 Socket Manufacturers and Specifications

Manufacturer, Address,
Contact
Model Name I/O Range RDRAM Device
Pitch (mm)
Technology
Description/Features
Phone, Fax, Web Site,
Notes
3M Electronic Handling & Protection Division 6801 River Place Blvd., Austin, TX 78726 Brian D. Abrams, Socket Business Unit Mgr.
bdabrams@3m.com
MicroTouch II (test) N/A N/A Wide bandwidth for high frequency testing (up to 10 GHz), low inductance, fine pitch and long operating life. 512.984.5942
512.984.5611 fax
[3m.com]
Acquired Tronix Corp.'s sockets business last year.
Aehr Test Systems
1667 Plymouth St.,
Mountain View, CA 94043
Rick Pendergrass
Data not available       650.691.9400
650.591.9300 fax
[aehr.com]
Aries Electronics
P.O. Box 130, Frenchtown,
NJ 08825
Frank Folmsbee, National Sales Mgr.
frankf@arieselec.com
RF Test Sockets 3-208 pins N/A Sockets contact mimics microstrip trace on PC board. Contact-self inductance only; 0.01nH; 1dB signal loss at 10GHz; package pitches down to 0.4 mm. 908.996.6841
908.996.3891 fax
[arieselec.com]
Azimuth Electronics Inc.
2605 S. El Camino Real,
San Clemente, CA 92672
RoJean Hall
sales@azimuthelectronics.com
Data not available       949.492.6481
949.492.0744 fax
[azimuthelectronics.com]
Cerprobe
1150 N. Fiesta Blvd., Gilbert, AZ 85233
info@cerprobe.com
Cerprobe HP 95000
Auto-Test Contactor
65-72 typical >1540 max 0.4 Jointly developed with Agilent Technologies, this socket is designed for the HP 95000 ATE system and offers an expected MTBF of more than 100,000 cycles. 877.333.2772
480.333.1670 fax
[cerprobe.com]
Cerprobe acquired OzTek last year.
DCI
3350 Scott Blvd, Bldg 58,
Santa Clara, CA 95054
Jason Langston
jason@dci-us.com
B62-0.8PRMBS
BGA4-62-0.8.1.0
B74-0.8ERMBS
B-74-0.8PRMBS BGA1-74-0.75
62
62
74
74
74
0.8
0.8
0.75
0.75
0.75
Microspring, self-cleaning, low inductance pin Pincer, burn-in socket Elastomer, 0.5nH inductance Microspring, self-cleaning, low inductance pin Pincer, burn-in socket 408.988.6800
408.988.8950 fax
[dci-us.com]
DCI acquired Liberty Research this year.
Everett Charles Technologies
Semiconductor Test Group
3020 S. Park Dr., Tempe, AZ 85282
Scott Novak, Worldwide Sales Director
novaks@ectinfo.com
BantamPak Standard BGA/LGA packages from less than 100 contacts to several thousand for custom. Supports both edge bond 0.75 and center bond, 0.8 x 1.00 package styles. High bandwidth, low consistent resistance through one million cycles, Bantam spring probes. Family footprint accommodates any DUT up to 26 x 26 array on a 1.27 mm pitch reloadable via probe palleting system. One-touch manual test lid available. 602.438.1112
[ectinfo.com]
ECT acquired PrimeYield Systems this year.
Enplas-Tesco
765 N. Mary Ave., Sunnyvale, CA 94086
Solomon Taufa
staufa@enplas.com
Data not available       408.749.8124
408.749.8125
Western Region
[enplas.com]
E-TEC Interconnect Ltd.
Forel, Switzerland
Bud Kundich, P.O.B. 4078,
Mountain View, CA 94040
mailbox@kundich.com
BGA/LGA/CSP Up to 1089 contacts 0.75, 0.80, 1.00, 1.27, 1.50.
2mm
Patented pin/spring design with various chip retention features, depending on life cycle requirements. 408.746.2800
408.746.0969 fax
[e-tec.ch]
Johnstech International
1210 New Brighton Blvd.,
Minneapolis, MN 55413
Randy Knudsen, Product Marketing Mgr.
info@johnstech.com
Various, dependent on handler/tester platforms Two-three land From edge bond 0.75 mm to center bond 0.8 x 1.0 mm and 0.8 pitch 256/288 MB DC-10 GHz, 0.375 mm-1.27 mm pitch. Patented short, rigid contact. BGA/CSP contacting method incorporates a "no damage zone," contacting the ball at 45 degrees, eliminating the possibility of damage to the ball-mounting plane. 612.378.2020
612.378.2030 fax
[johnstech.com]
Loranger International Corp.
817 Fourth Ave., Warren, PA 16365
Ariane Loragner,
Sales and Marketing Mgr.
licsales@loranger.com
0800700
48U6617
1200700
48U6617
48

48
0.75 and 0.8 versions Surface mount sockets for test and burn-in applications. 814.723.2250
814.723.5391 fax
[loranger.com]
Silicon Valley:
408.727.4234
408.727.5842 fax
Plastronics
2601 Texas Dr., Irving, TX 75062
David Pfaff,
Vice President-Marketing
david@locknest.com
N/A N/A Does not participate in the memory socket business New line of sockets is for test and burn-in of VFQON devices. The scoket will include a .150 inch tall contact with <3nH of inductance capable of over 10k burn-in cycles. 972.258.2580
800.582.5822
972.258.6771 fax
800.582.5890 fax
[locknest.com]
PrimeYield Systems
4837 White Bear Pkwy., St. Paul, MN 55110
James Brandes, Product Manager
jimb@primeyield.com
µHPC/PL, µHPC/GA No limit Down to 0.5 mm Offers path lengths as short as 3.5 mm. µHPC/GA employs solid pins for contact elements and anisotropic conductive elastomer. µHPC/PL uses micro-lead cantilever spring contacts. 651.407.7726
651.407.7290 fax
[primeyield.com]
PrimeYield was acquired by ECT this year.
Rika-Denshi America
112 Frank Mossberg Dr., Attleboro, MA 02703
Ron Mendler
mendler@testprobe.com
Data not available       508.226.2080
508.226.2980 fax
[testprobe.com]
Synergetix (IDI)
310 s. 51st St., Kansas City, KS 66106
Joe Bunch,
Product Specialist
info@synerget.com
Ultra-Performance Rambus Test Sockets No limit All RDRAM pitches Socket features the Ultra-Performance Chip-Scale Probe which is designed for high-speed devices, such as Rambus. Socket employs a micro-precision spring-loaded contact. 913.342.0404
913.342.6623 fax
[synerget.com]
Tecknit
129 Dermody St., Cranford, NJ 07016
Bill Richline
wrichline@tecknit.com
Data not available       908.500.0092
800.443.1085 fax
[tecknit.com]
Texas Instruments Interconnection Business
111 Forbes Blvd., Mansfield, MA 02048
Ed Craig,
Sales and Marketing Manager
ecraig@ti.com
TI 0.5 mm Touch-Spring 40, 84, 241 (higher and lower for custom aps.) 0.5 mm Low-cost 0.5 mm clamshell burn-in socket with 0.5m micro-spring contact system. Surface mount onto burn-in board. 13g contact force to IC and burn-in board. 508.236.5266
508.236.5339 fax
[ti.com/mc/igb]
TI France: +33.13.070.1105 TI Korea: +82.2.551.2928 TI Singapore: +65.833.6007/6108
UREX Precision Inc.
Sec. 4, Chung Hsing Rd., Chutung Hsinchu, Taiwan 310
Hans Ho, President
hansho@urex.com.tw
CSP-BGA Sockets 36-56, higher and lower for custom aps. Down to 0.65 mm Modularized CSP burn-in socket with replaceable interposer and adapter. Employs proprietary ring-contacting system. +886.3.5833678
+886.3.583345 fax
[urex.com.tw]
Wells-CTI
3502 N. Oliver, South Bend, IN 46628
Mark Murdza, Product Marketing Manager
murdzam@wellscti.com
706 Series RDRAM 144
MB Socket
54-62 1.0 mm x 0.8 mm Pinch/tweezer-style contact; open top, small outline, low actuation force, device retention arms and through-hole contact tails. 623.581.5330
623.780.3987 fax
[wellscti.com]
Represents merger of CTI Technologies and Wells Electronics.
Yamaichi
2235 Zanker Rd., San Jose, CA 95131
Frank Lessani
frank.l@yeu.com
Data not available       408.456.0797
408.456.0799 fax
[yeu.com]

 
 
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