An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics July - August 2000 Email the editor

ERSA Offers New Inspection System

ERSA has introduced the ERSASCOPE Inspection System 3000, for non-destructive inspection of good solderability by a visual examination of hidden solder joints. The ERSASCOPE is a bench-top method for quickly inspecting all types of CSPs, in addition to many other applications, including interior fillets of PQFP and PLCC packages, where a microscope or x-ray is not suitable. The unit displays a real-time video image on the monitor, which can be complemented by up to four pop-up reference images chosen from the image databank. An automatic measurement control function displays and stores measurements that exceed established tolerances, set specifically by QC, for each type of component and PWB. ERSA Inc., 6 Vista Dr., Old Lyme, CT 06371, 860.434.8091, fax, 860.434.5448.

ERSASCOPE Inspection System 3000

Mounter Handles Through-Hole Devices

The Philips ACM Micro mounter, designed for placement of flip chips, µBGA packages and other CSPs, will now place odd-form and through-hole components, as well.

Two pairs of placement heads with adjustable placement force and automatically exchangeable grippers and vacuum nozzles pick components from both the front and rear of the unit.

This capability enables one machine to place QFPs as large as 50 mm square and flip chips with a .006 bump pitch, as well as odd forms and through-home components up to 50 mm tall.

Other features include a high-resolution FPD, high-res camera with 100% bump alignment and flexible vision software for varying ball patterns.

Philips, 5110 McGinnis Ferry Rd., Alpharetta, GA 30005, 770.751.4420, fax 770.751.4450.

Industrial Tools Inc. Launches New Saw

Industrial Tools Inc. has launched a new saw for singulating IC packages, including BGAs, CSPs, chip carriers and other packages.

Known as the ITI-2000, the singulating system features very high throughput, a high-speed vision alignment system, rapid parts changeover and a small footprint, according to ITI.

The ITI-2000, in addition to high-speed alignment, can align to each individual street to account for part-to-part variations.

Industrial Tools Inc., 1111 S. Rose Ave., Oxnard, CA 93033, 805.483.1111, fax 805.483.6302.

Mask Aligner Suitable for Wafer Bumping

OAI's model 5000 fully automated contact/proximity mask aligner with the Windows NT operating system is targeted at wafer bumping, backside alignment and photosensitive polyimide processes. An auto-align option provides an overlay accuracy of better than ±5 microns. A dual focus option compensates for resist thicknesses of greater than 100 microns. The standard unit exposes up to 200 mm wafers and includes robotic handling, UV light intensity control and feedback with an advanced auto-alignment system. A model 5000 aligner designed for 300 mm wafers is also available.

OAI's model 500 mask aligner

Optical Associates Inc., 1425 McCandless Dr., Milpitas, CA 95035, 408.263.4944, fax 408.263.6389.

Ceramic Packages Targeted for RFI Use

CirQon Technologies has introduced standard and custom leadless packages for RFI circuit applications, which feature plated and bonded copper (PBC) on alumina ceramic for superior electrical and thermal conductivity.

CirQon Technologies Corp., 1394 St. Paul Ave., Gurnee, IL 60031, 847.360.1900, fax 847.360.1910.

Speedline's Electrovert Offers Aqueous Cleaner

Speedline Electrovert has introduced the AquaJet aqueous cleaning system for the PWB assembly and semiconductor markets. The AquaJet is a multi-function batch cleaner designed to clean and dry PWBs, BGAs, (BGA packages and flip chips, as well as stencils, screens, misprints and glue and solder-paste setups. The cleaner performs like an in-line system and features proprietary pump and nozzle technology that removes contaminants by maximizing flooding in some sections and impact force in others for cleaning tight spaces.

Speedline Electrovert's AquaJet aqueous cleaner

AquaJet's stand-off component cleaning ability includes complete penetration into small and narrow apertures and underneath BGAs and flip chips, the company says.

Speedline Electrovert, P.O. Box 709, Camdenton, MO 65020, 573.346.3341, fax 573.346.6878 [speedlinetechnologies.com]

Leica Microsystems Enters AOI Marketplace

Leica Microsystems Inc. has entered the market for component placement inspection and solder-paste inspection with its IRIS 1000 system. According to Leica, the unit offers 100% coverage for paste area, xy position and bridigng, with dynamic repeatability >5% for 2D work. For 3D inspection, the system measures solder paste height, volume and profile approaching 100% coverage and dynamic repeatability <7%.

OAI's model 500 mask aligner

Used for component placement inspection, the system detects anomalies in the presence/absence, offset, skew, polarity, billboard and tombstoning of devices, parts markings, extra parts, etc.

A combination of strobe and scanning laser illumination, together with one multi-spectral sensor and parallel image processing achieves unique speed and accuracy performance, according to Leica. The system is Windows NT based.

Leica Microsystems Inc., 111 Deer Lake Rd., Deerfield, IL 60015, 800.248.0665, fax 734.665.0593

Intelligent Reasoning Systems Intros AOI 4000

Intelligent Reasoning Systems Inc. has introduced the IOI 4000, an intelligent optical inspection system for component and board-level inspection.

According to IRSI, the unit delivers faster overall inspection times, an advanced mechanical design, SMT line placement flexibility and faster adaptation to acceptable process variations than competitive systems.

Board-level inspection has been optimized for bridge and insufficient solder detection on components down to 16-mil pitch. A fully integrated SPC module allows the IOI 4000 to function as an integral part of the user's control process, enabling higher yields.

A high-speed linescan camera and a modular computing engine work together to provide increased acceleration. The system's computing engine employs plug-in DSP cards to perform image processing. Users can add DSP cards to increase board throughput as needed.

Intelligent Reasoning Systems Inc., 100 Michaelangelo Way, Austin, TX 78728, 512.583.4100, fax 512.302.5246 [irsinc.com]

Vitronics Soltec Debridging System

Vitronics Soltec has launched the SelectX selective debridging system, which removes solder bridging from wave-soldered PWBs.

Said to be especially suited to tight board geometries and ultrafine pitch SMT components, SelectX employs an advanced proprietary directed "tuned" force gas flow technology to eliminate solder bridges while they are still liquid.

The ability to tune the gas flow and bring the nozzles into very close proximity of the PWB, without contact, is key to the precise selectivity of the debridging system.

When SelectX displaces excess solder, eliminating bridges, it doesn't disturb good solder joints because it can be directed to specific areas where bridging is most likely to occur, according to the manufacturer. SelectX is available with Vitronics Soltec's Delta and DeltaMax wavesoldering systems.

Vitronics Soltec North America, 2 Marin Way, Stratham, NH 03885, 603.772.7778, fax 603.772.7776.