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 Publisher's Letter
Get Ready for the Upturn!

 Assembly Lines
Are MEMS, MOEMS and Opto-Electronics in Your Future?

 Electronic Trends
Industry Outlook: IC Unit Shipments and Revenues Poised for Decline

 On Test
Are You Ready for the Personal Tester?

 Industry News
HD International Debuts at Silicon Valley Venue
Company News
People in the News
Packaging Foundries
Calendar of Events
Editorial Index

 Features
Cover Story: IC Packaging Foundries - A Work In Progress
Packaging Foundry Vendor Table

Special Report: The Status of the Worldwide Packaging Foundry Industry 2001

Opinion: CSPs Are Putting a New Spin on IC Assembly

An Expert Looks at the Issues: Ed Combs on Integrated Circuit Assembly

 Tutorial
An Overview of Flip-Chip Technology

 Feature/Materials
Using Silicone Materials in Lead-Free CSP Processing

 Technical Forum
The Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu/Bi Solder

 Tools & Technologies
300-mm-Capable Die Attach System Debuts and more...

 Patents
Composite Ceramic Substrate Minimizes Microcracking

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2001
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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
May - June 2001
Packaging Foundry Vendor Table

Packaging Foundry Vendor Table
Employees
A = <100
B = 100-500
C = 501-1,000
D = 1,001-2,000
E = 2,001-5,000
F = >5,000
Customers by Region
A=Asia (except Japan)
B=Europe
C=Japan
D=North America
E=Rest of World
Package Materials Offered
A=Ceramic
B=Plastic
C=Metal
D=Other
Dedicated Lines
A=None
B=1-2
C=3-5
D=5+
Quality Audits
A=ISO-9001
B=ISO-9002
On-Site Test
A=Opens/Shorts
B=RF
C=Memory
D=Logic
E=Analog/Mixed-Signal
Company
Address
Founded
Phone
Fax
Chairman
President
CEO
COO
Other Title
(Advertisers are shown in Bold Face type)
Employees
(Stock Symbol, Exchange, High & Low in USD, Began Trading)
1999 Sales
2000 Sales
Customers by Region
Package Materials Offered
Max # Leads
(Dedicated
Lines)
Manufacturing Area Meters2
(Percent Area Devoted
to Assembly/Test,
CSPs
Quality
Audits
(On-site
Test)
Highest
Volume Package
Monthly Capacity
Web Site
Phone
Fax
Customer Contact
Other Offices
Former Name
Bumping FC WLP Internet
Advanced Interconnect Technologies
6800 Koll Center Parkway, Suite 220
Pleasanton, CA 94566
925.426.3100
925.426.2323
(1991)
Ralph Duceour
(Also CEO)
F
$300 Million
A=2
B=25
C=3
D=70
B, C
731 EPBGA
(A)
65,000
(80/20)
None
A, C, D, E
(A, B, C, D, E)
SOIC
70KK
aitsales.com
Garron Perrotti
gperrotti@aitna.com
(Advanced Microtronics Technology, PT Astra)
- - - X
Alphatec Holding Co., Ltd.
17/2 Moo 18, Suwintawong Rd.
Chachoengsao 24000, Thailand
+66.38.593.2235
+66.38.593.229
(1999)
John Lin
Apichat Natasilpa
(Also CEO)
D
A=15
C=5
D=80
A, B
208-PQFP
300+ CPGA
(B)
25,000
(80/20)
None
QML
from DSCC
(A, C, D, E, image sensor functional)
SOIC/J
50K
alphatec.co.th
ATS Services Co.
1680 Civic Center Dr., Suite A
Santa Clara, CA 95050
408.249.0055
408.249.0065
Scott Sylvester, VP
ssylvester@atssc.com
(Alphatec Electronics Public Co.)
- - - X
Amertron Inc.
(1996)
        amertron.com.ph
Philippines
See Pantronix
       
Amkor Technology Inc.
1345 Enterprise Dr., West Chester, PA 19380
610.431.9600
610.431.5881
(1970)
James J. Kim
(Also CEO)
John N. Baruch
(Also COO)
F
(5-1-98-AMKR, NASDAQ,
65-5/16
Low 3)

$1.91 billion
$2.39 billion
NA
A, B, C
NA
(E)
NA
(NA)
NA
NA
(A, B, C, D, E)
SOIC
NA
amkor.com
Operations Hq:
1900 South Price Rd.
Chandler, AZ 85248
480.821.5000
480.821.8276
Patrick McKinney, Senior VP Corp. Marketing
pmcki@amkor.com
3945 Freedom Circle, Suite 830
Santa Clara, CA 95054
408.496.0303
408.496.0392
(Amkor Electronics Inc.)
X X X X
ASAT Ltd.
QPL Industrial Building, 138 Texaco Rd.
Tsuen Wan, NT, Hong Kong
+852.2408.7811
+852.2407.4056
1988
Andrew Liu
Jerry Lee
(Also CEO)
E
(7-11-00-ASTT, NASDAQ,
12.375
Low 3.25)
NA
$375.3 Million
A=42
B=10
D=48
B
>1000 BGA
(A)
147,828
(70/30)
None
A, B, C, D, E
(A, B, D, E)
LQFP/TQFP
30KK
FPBGA
50KK
asat.com
ASAT Inc.
46335 Landing Parkway
Fremont, CA 94538
510.249.1222
510.249.9105
Andy Anderson, Marketing Director
andy_anderson@asat.com
- X - X
ASE Inc.
333 Keelung Rd., Sec. 1
Taipei, Taiwan
+886.2878.05489
+886.2757.6121
(1984)
Jason Chang
Dr. Leonard Liu
Richard Chang
F
(9-26-2000-NYSE, 7-1/16
Low 3-1/16)
$1.02 billion
$1.64 billion
A=30
B=3.7
C=1.1
D=65.1
A, B, C
1,521 FCBGA
(E)
NA
(NA)
Fujitsu BCC, Motorola, Flip Chip Technologies, Tessera µBGA
B, C, D, E
(A, B, C, D, E)
NA aseglobal.com
ASE (U.S.) Inc.
3590 Peterson Way,
Santa Clara, CA 95054
408.986.6500
408.565.0289
Jennifer Yuen, Marketing Director
jennifer.yuen@aseus.com
Hong Kong, Korea, Malaysia, Philippines, Singapore, Taiwan
X X X X
Atlantic Technology (UK) Ltd.
Pen-y-fan Industrial Estate
Croespenmaen, Crumlin
S. Wales UK NP11 3XT
+44.1495.244111
+44.1495.244828
(1995)
Jeff Baloun
B
NA
$20 million
B=80
D=20
B
600 BGA
(E)
39,624
(70/20)
None
B, D (pending)
(NA)
QFP, S/QSOP
12KK
atlantic1.co.uk
Atlantic Technology (USA) Inc.
809 Steve Hawkins Pkwy.
Marble Falls, TX 78654
830.798.0700
830.798.2700
Carl Lehtonen, President
carl.lehtonen@atlantic-us.com
(Management buyout of ASAT’s Wales’ facility)
- X - X
Carsem
Jalan Lapangan Terbang
30720 Ipoh, Perak, Malaysia
+60.5.312.3333
+60.5.312.5333
(1972)
Kwek Leng San
Group Mng. Dir: David Comley
F
(1984- MPI (MPIM.KL) Kuala Lumpur, $15
Low $3.80)
NA
NA
A=5
B=30
C=5
D=60
B
 
 
324 SSBGA
(C)
360,000
(90/10)
None
A, B, C, D, E
(A, B, C, D, E)
SOT23
150KK
carsem.com
Carsem Inc. (USA)
17890 Castleton St., Suite 245
City of Industry, CA 91748
626.854.0939
626.854.9139
Gerry Blackholly
gblackholly@carsem.com
Carsem Inc. (USA)
269 Mt. Hermon Rd., Suite 104
Scotts Valley, CA 95066
831.438.6861
831.438.6863
Paul Smith, Marketing Director
psmith@carsem.com
Carsem Europe
1st Floor, Potters Walk, 134 High St., Swindon, SN4 7AY England
+44.1793.853888
+44.1793.855388
(Carter Semiconductor acquired by Hong Leong Group, Malaysia in 1984 and part of Mayaysia Paacific Industries, owner of Carsem and Dynacraft)
 
Q4 X - X
ChipMOS Technologies Inc.
Nr. 1 R&D Rd., Hsinchu, Taiwan
+886.3.577.0055
+886.3.566.8989
(1997)
H.C. Hu
S.J. Cheng
(Also CEO)
E
$205 Million
$265 Million
A=50
C=40
D=10
B
100 TQFP
(C)
120,000
(33/67)
µBGA
B, C, E
(A, C, D, E)
Leadframe, type NA
15KK
chipmos.com.tw
ChipMOS U.S.A. Inc.
1245 Tiros Way
Sunnyvale, CA 94086
408.830.9401
408.830.9143
Steve Chen
steve_chen@chipmos.com.tw
Taiwan
- - - X
ChipPAC Inc.
3151 Coronado Dr., Santa Clara, CA 95054
408.486.5900
408.486.5910
(1997)
Dennis McKenna
(Also CEO)
F
(8-9-2000-CHPC, Nasdaq, $19.50,
Low 2.18)
$375.5 Million
$494.4 Million
A=10
B=10
C=5
D=75
A, B, C
2000 BGA
(E)
77,314
(63/37)
µBGA
A, B, C, D, E
(A, B, C, D, E, power discretes)
SOIC
125KK
chippac.com
Greg Bronzovic, VP-Sales
greg.bronzovic@chippac.com
(MBO of Hyundai’s Assembly & Test Division. Malaysian facility acquired from Intersil.)
X X X X
Chip Supply Inc.
7725 Orange Blossom Trail, Orlando, FL 32810
407.298.7100
407.290.0164
(1978)
Edward J. Perrott
(Also Pres. and CEO)
B
A=1
B=12
C=2
D=84
E=1
A, B, C
361 BGA
(B)
NA
(55/45)
None
B
(A, C, D, E)
BT Laminate BGA
125K
chipsupply.com
Scott Smith, Worldwide Sales Manager
ssmith@chipsupply.com
.
X - - -
Cirtek Electronics Corp.
116 East Main Ave.
Laguna Technopark, Laguna, Philippines
+63.49.541.2310~2315
+63.49.541.2317
(1984)
Crismel Verano
Jerry Liu
(Also CEO)
D
A=3
B=5
C=10
D=80
E=2
A, B, C
NA
(C)
24,384
(90/10)
None
B, BABT
(A, B, D, E)
8-, 14-, 16 Pin PDIP
5KK
cirtek.com.ph
Cirtek Semiconductor Inc.
290 Harbor Blvd., Belmont, CA 94002
650.637.8393
650.637.8395
Norman Chang
n_chang@pacbell.net
- X - X

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