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Packaging Foundry Vendor Table
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| Packaging Foundry Vendor Table |
Employees
A = <100
B = 100-500
C = 501-1,000
D = 1,001-2,000
E = 2,001-5,000
F = >5,000
|
Customers by Region
A=Asia (except Japan)
B=Europe
C=Japan
D=North America
E=Rest of World
|
Package Materials Offered
A=Ceramic
B=Plastic
C=Metal
D=Other
|
Dedicated Lines
A=None
B=1-2
C=3-5
D=5+
|
Quality Audits
A=ISO-9001
B=ISO-9002 |
On-Site Test
A=Opens/Shorts
B=RF
C=Memory
D=Logic
E=Analog/Mixed-Signal |
Company
Address
Founded
Phone
Fax
Chairman
President
CEO
COO
Other Title
(Advertisers are shown in Bold Face type)
|
Employees
(Stock Symbol, Exchange, High & Low in USD, Began Trading)
1999 Sales
2000 Sales
Customers by Region
Package Materials Offered |
Max # Leads
(Dedicated
Lines)
Manufacturing Area Meters2
(Percent Area Devoted
to Assembly/Test,
CSPs
|
Quality
Audits
(On-site
Test)
|
Highest
Volume Package
Monthly Capacity
|
Web Site
Phone
Fax
Customer Contact
Other Offices
Former Name
|
Bumping
|
FC
|
WLP
|
Internet
|
Corwill Technology Corp.
2127 Ringwood Ave., San Jose, CA 95131
408.321.6404
408.321.6407
(1990)
Robert C. Corrao
(Also CEO)
|
B
A=5
B=5
C=2
D=88
A, B
|
1200 BGA
(E)
1,400
(85/15)
NA
|
B, DSCC
(DSCC lab for MILSTD-883 environmental screen)
|
DIP
200K
|
corwil.com
Rosie Medina
info@corwil.com
.
|
-
|
X
|
-
|
-
|
EEMS Italia SpA
Viale Delle Scienze
Cittaducale, Italy 02015
+746.6041
+746.604262
(1994)
Bruno Steve
Vincenzo D’Antonio
(Also CEO)
|
C
A=5
B=90
D=5
B
|
144 FBGA
©
21,000
(45/55)
µBGA
|
B
©
|
54 TSOP
20KK
|
eems.it
EEEMS Italia SpA (U.S)
111 Deerwood Rd. #200/39
San Ramon, CA 94583
925.831.4774
925.831.9278
Harry Rozakis, Executive VP
hrozakis@worldnet.att.net
(Founded 1969 by Texas Instruments; sold 1994. Singapore plant acquired from Tessera.)
|
-
|
-
|
-
|
X
|
Hana Microelectronics Ltd.
10/4 Moo 3 Vibhavadi-Rangsit Rd., Bangkok 10210, Thailand
+66.2.551.1297
+66.2.551.1299
(1978)
Richard Han
(Also CEO)
Winson Hui
|
F
(1978) SET, Stock Exchange of Thailand
$10.10-
Low $0.40
$37 Million
$53 Million
A=2
B=5
C=8
D=85
B, C
|
100 QFP
©
50,000
(60/40)
None
|
A
(A, C, D, E)
|
SOT 23
20KK
|
hanagroup.com
Hana Microelectronics Inc.
25 Metro Dr., Suite 238
San Jose, CA 95110
408.452.7474
408.452.7488
B.K. Ng, Engineering Mgr.
bk_ng@hanaus.com
(Microdisplay Technologies)
|
-
|
-
|
-
|
X
|
Integrated Packaging Assembly Corp.
2221 Oakland Rd.
San Jose, CA 95131
408.321.3600
408.321.3603
(1993)
Ch/P/CEO:Edmond Tseng |
B
(1996)
(IPAC, Nasdaq OTCBB, 52 week $0.56-
Low $0.04)
D=100
B
|
2000
(A)
NA
(90/10)
µBGA
|
B
(A)
|
208 QFP
3KK
|
ipac.com
Dr. Gerald K. Fehr, Chief Technical Officer
gfehr@ipac.com
(Subsidiary of OSE, Taiwan, which began investing in the company in April 1999.)
|
-
|
X
|
X
|
X
|
Kingpak Technology Inc.
Nr. 84 Taiho Rd.
Hsinchu, Taiwan
+886.3.553.5888
+886.3.552.0699
(1998)
C/CEO: Joe Liu
C.H. Chou
|
C
A=40
B=20
D=40
A, B
|
750 EBGA
(A)
54,225
(50/50)
TFBGA
|
B
(A, B, C, D, E, CMOS image sensor)
|
TFBGA
20KK
|
kingpak.com
Kingpak Technology Inc.
3350 Scott Blvd., Bldg 48
Santa Clara, CA 95054
408.988.1408
408.988.0802
Martin Paul
martin@kingpak.com
|
|
|
|
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Meicer Semiconductor Inc.
10F, Nr. 380, Section 1, Fu Shing S. Rd.,
Taipei, Taiwan 106
+886.2.2701.9066
+886.2.2709.6319
(1997)
Charles Ho
Dr. William Yueh
(Also CEO)
|
C
A=35
B=5
C=10
D=50
B
|
NA
(D)
225,000
(90/10)
µBGA
|
B
(A, C, E)
|
SOT2X
25KK
|
meicer.com.tw
Meicer USA Inc.
48006 Fremont Blvd.
Fremont, CA 94538
510.657.6378
510.657.6206
Christina Wang, Manager
wangtsaimei@hotmail.com
|
-
|
-
|
-
|
X
|
Multichip Assembly
San Jose, CA
408.271.2740
(1991)
|
A
N=100
|
|
|
|
multichipassy.com
|
|
|
|
|
NS Electronics Bangkok
40/10 Sukhumvit Soi 105, Bangna, Bangkok 10260 Thailand
+66.2.749.1680
+66.2.398.7157
(1993)
C/CEO: Thamnu Wanglee
Udom Udompanyavit
|
E
$76 Million
$105 Million
A=10
B=40
D=50
B
|
200 PSGA
(A)
380,000
(70/30)
Fujitsu BCC
Siemens PSGA
|
A, B, C, D, E, Ford Q1
(A, B, C, D, E, wafer test)
|
SOIC/QSOP
90KK
|
nseb.com
NS Electronics (USA) Inc.
298 S. Sunnyvale Ave., Sunnyvale, CA 94086
408.749.9155
408.749.9239
Jerry Kirby, Sales & Marketing Director
jkirby@nseb.com
NSE Europe
Herbert Streussnig
semis.streussnig@aon.at
Formerly National Semiconductor, Bangkok
|
-
|
X
|
-
|
X
|
Orient Semiconductor Electronics Ltd.
9 Central 3d St. N.E.P.Z., Kaohsiung, Taiwan 811
+886.7.361.3131
+886.7.363.2319
(1971)
C/CEO: Mrs. Mei Shou Yang
Calvin Lee
|
F
(1994) 2311, Taiwan Stock Exchange
Prices NA
$320 Million
$440 Million
A=35
B=20
C=5
D=40
B
|
836 EBGA
(E)
565,099
(excludes IPAC)
(66/34)
µBGA
|
B, E
(A, B, C, D, E)
|
SSOP
45KK
|
ose.com.tw
IPAC/OSEI
2221 Oakland Rd.
San Jose, CA 95131
408.953.6450
408.383.0858
Tom Majeski, VP-Sales & Marketing
tom-majeski@ose.com.tw
|
-
|
X
|
-
|
X
|
Pantronix Corp.
2710 Lakeview Court, Fremont, CA 94538
510.656.5898
510.656.7779
(1974)
Ch/Pres/CEO:
Stanley Wang
|
B (Excludes Amertron)
A=60
B=5
C=5
D=30
(Includes Amertron)
A, B, C, Subsystems
|
1000 BGA
(NA)
250,000
(includes Amertron)
(75/25)
(includes Amertron)
None
|
B, QML Qual 2nd Party and DCSS Certified
(A, B, C, D, E, In-Circuit Test)
|
Type NA
20KK
|
pantronix.com
Bret Butler, Program Management Director
bbutler@pantronix.com
|
-
|
X
|
X
|
X
|
Signetics Corp.
483-3 Puphung-ri, Tanhyun-myun, Paju City, Korea 413-840
+82.31.940.7922/23
+82.31.940.7691
(1996)
H.J. Chang
S.J. Yang
(Also CEO)
|
D
NA
$200 Million
A=40
B=35
D=25
B, Modules
|
834 STBGA
(B)
65,000
(80/20)
None
|
A, C, D, E
(A, B, C, D, E)
|
FPBGA
10KK (leadframe)
MQFP
10KK
(Surface Mount)
|
signetics.com
Signetics High Technology Inc.
1737 N. First St., Suite 400
San Jose, CA 95112
408.467.0660
408.467.0667
Greg Johnson, VP-Sales
gjohnson@signeticsusa.com
Signetics High Technology Inc.
349 Stonehouse Dr.
Severna Park, MD 21146
410.421.5979
410.421.9443
Jim Laite
jlaite@signeticsusa.com
Signetics Ltd. Europe
13 Chemin du Levant
01210 Ferney-Voltaire, France
+33.450.40.6163
+33.450.40.6257
Originally founded by Signetics of Sunnyvale, Calif. in 1965 as one of its assembly and test facilities. Signetics was later acquired by Philips, which divested the assembly plants.
|
-
|
X
|
-
|
X
|
SPIL Group
Nr. 123, Section 3, Da Fong Rd., Tantzu, Taichung, Taiwan
+886.4.534.1525
+886.4.533.0639
(1984)
Ch/CEO: Bough Lin
C.W. Tsai
|
F
(4-7-93)
Taiwan Stock Exchange, SPIL, NTD $140- Low NTD$16
$454 Million
$696 Million
A=5
B=5
C=10
D=45
E=35
B
|
1521 FCBGA
(B)
182,000
(83/17)
µBGA
Ultra CSP
|
A, B, C, E, ISO-17025
(A, B, C, D, E)
|
QFP
89KK
|
spil.com.tw
Siliconware USA Inc.
1735 Technology Dr.,
Suite 300
San Jose, CA 95110
408.573.5500
408.573.5530
Eleanor Feng, Sales Manager
eleanorf@spilca.com
|
X
|
X
|
X
|
X
|
ST Assembly Test Services Ltd. (STATS)
5 Yishun St. 23
Singapore 768442
+65.755.5885
+65.755.5431
(1995)
Ch/CEO: Tan Bock Seng
|
E
(1-28-2000)
Nasdaq- STTS (SGX:ST Assembly- (Singapore Exchange)
63.62-Low 11-7/16
$201.1 Million
$331.3 Million
A=10
B=18
D=72
B, laminate
|
600+ FEBGA
(E)
300,000
(NA)
None
|
A, B, C, D, E
(A, B, C, D, E)
|
QFP
NA
|
stts.com
ST Assembly Test Services Inc. (STATS)
1450 McCandless Dr., Milpitas, CA 95035
408.941.1500
408.941.3014
George Brathwaite, Sales Director
gab@statsus.com
ST Assembly Test Services Inc. (STATS)
9180 S. Kyrene #101
Tempe, AZ 85284
480.961.7033
480.961.1511
Jeff Osmun, VP-North American Sales
osmunj@statsus.com
ST Assembly Test Services Inc. (STATS)
144 Turnpike Rd., Suite 320
Southboro, MA 01772
508.624.6800
508.624.6850
Chris Langhammer, Sales Director
langhammer@statsus.com
|
X
|
X
|
X
|
X
|
Team Pacific Corp.
Electronics Ave., FTI Complex, Taguig, Metro Manila, Philippines
+63.2.838.5005~11
+63.2.838.5012~13
(1987)
Ch/CEO/Pr: Federico M. Fernandez
|
D
$23.5 Million
$26.2 Million
A=20
B=25
D=55
B, C
|
16 PDIP (hybrid)
(NA)
7,789
(88/12)
None
|
B, D, E, MIL-PRF-19500, MIL-PRF-38585,
(A, B)
|
TO-247
1.2KK
|
teamglac.com
Golden Link America Corp. (GLAC)
1799 Old Bayshore Hiway, Suite 135
Burlingame, CA 94010
650.652.4606
650.652.4612
Ceferino F. Bautista, Senior VP Marketing & Sales
gene29@pacbell.net
|
-
|
-
|
-
|
-
|
VLSI Packaging Corp.
750 Presidential Dr.
Richardson, TX 75081
972.437.5506
972.644.1286
(1984)
Robert Gilbert
New Business Development Manager
|
NA
B=15
D=80
E=5
A, B, C, Laminates |
960 EBGA
(E)
8,000
(80/20)
NA |
B, MIL-STD-883, MIL-PRF-38535
(A, F) |
NA
|
vlsip.com
r.gilbert@vlsip.com |
-
|
X
|
X
|
X
|
Walsin Advanced Electronics Ltd.
18 North 1st Rd. KEPZ, Kaohsiung, Taiwan
+886.7.811.5191
+886.7.821.4758
(1995)
Y.H. Chiou
J.Y. Hung
|
E
A=60
C=30
D=10
B, Laminates
|
460 PBGA
(B)
65,000
(85/15)
None
|
B, C, E
(A, B, C, D, E)
|
TSOP/TSSOP
20KK
|
wae.com.tw
Walsin Advanced Electronics
260 E. Appaloosa Court
Gilbert, AZ 85296
480.558.1784
480.558.1785
Jim Kelley, Senior VP-Marketing & Sales
jkelleyieps@cs.com
|
X
|
X
|
-
|
X
|
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